Inventor · disambiguated record
Wolfgang Molzer
Also filed as: MOLZER WOLFGANG
10 granted patents·11 pending applications·49 citations·filing 2002–2025
85Inventor score
Top patents by PatentIndex Score
21 records- 0192US9252077B2Package vias for radio frequency antenna connectionsMOLZER WOLFGANG·Filed 2013·Granted Feb 2, 2016·32 cites·17 claims
- 0285US9564400B2Methods of forming stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2016·Granted Feb 7, 2017·4 cites·19 claims
- 0379US9209143B2Die edge side connectionINTEL IP CORP·Filed 2013·Granted Dec 8, 2015·5 cites·24 claims
- 0470US9373588B2Stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2013·Granted Jun 21, 2016·2 cites·20 claims
- 0567US10845073B2Method and device for temperature control in a radio receiverAPPLE INC·Filed 2016·Granted Nov 24, 2020·1 cites·20 claims
- 0659US2025261300A1Methods and apparatus to cool hotspots in integrated circuit packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0755US6750483B2Silicon-germanium bipolar transistor with optimized germanium profileINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 15, 2004·5 cites·6 claims
- 0855US2025112202A1Thermal interface material on a surface of a die in a cavityINTEL CORP·Filed 2023·Application pending·0 cites
- 0955US2025112139A1Vias through a die that are electrically isolated from active circuitry in the dieINTEL CORP·Filed 2023·Application pending·0 cites
- 1053US12431424B2Buried power rails integrated with decoupling capacitanceINTEL CORP·Filed 2021·Granted Sep 30, 2025·0 cites·18 claims
- 1153US12057411B2Stress relief die implementationINTEL CORP·Filed 2019·Granted Aug 6, 2024·0 cites·25 claims
- 1249US2023317544A1Integrated circuit packages having reduced z-height and heat pathINTEL CORP·Filed 2022·Application pending·0 cites
- 1349US2023300975A1Integrated circuit packages having reduced z-heightINTEL CORP·Filed 2022·Application pending·0 cites
- 1448US2023197644A1Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor DieINTEL CORP·Filed 2021·Application pending·0 cites
- 1547US9583595B2Methods of forming low noise semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 28, 2017·0 cites·28 claims
- 1647US2023197566A1Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and MethodsINTEL CORP·Filed 2021·Application pending·0 cites
- 1747US2023197615A1Transformers based on buried power rail technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 1846US9171726B2Low noise semiconductor devicesCALABRESE GIOVANNI·Filed 2009·Granted Oct 27, 2015·0 cites·29 claims
- 1946US2023094594A1Back Side Power Supply for Electronic DevicesINTEL CORP·Filed 2021·Application pending·0 cites
- 2042US2016225694A1High conductivity high frequency via for electronic systemsBARTH HANS-JOACHIM·Filed 2013·Application pending·0 cites
- 2137US2015001713A1Multiple level redistribution layer for multiple chip integrationGOETZ EDMUND·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →