Inventor · disambiguated record
Woojung Park
Also filed as: PARK WOOJUNG
7 granted patents·3 pending applications·21 citations·filing 2019–2024
78Inventor score
Top patents by PatentIndex Score
10 records- 0193US10565555B1Systems and methods for scheduling inbound products, stowing inbound products, and monitoring inbound errorCOUPANG CORP·Filed 2019·Granted Feb 18, 2020·12 cites·15 claims
- 0291US10565544B1Computer-implemented systems and methods for transferring a return item to fulfillment centers for inventory managementCOUPANG CORP·Filed 2019·Granted Feb 18, 2020·9 cites·16 claims
- 0376US12360457B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0466US12044974B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 0566US11783290B2Systems and methods for scheduling inbound products, stowing inbound products, and monitoring inbound errorCOUPANG CORP·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 0664US11055663B2Systems and methods for scheduling inbound products, stowing inbound products, and monitoring inbound errorCOUPANG CORP·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 0762US2021142278A1Computer-implemented systems and methods for transferring a return item to fulfillment centers for inventory managementCOUPANG CORP·Filed 2021·Application pending·0 cites
- 0861US10922644B1Computer-implemented systems and methods for transferring a return item to fulfillment centers for inventory managementCOUPANG CORP·Filed 2020·Granted Feb 16, 2021·0 cites·20 claims
- 0947US2024038551A1Coating composition for wafer protection and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1046US2025022811A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →