Inventor · disambiguated record
Wolfgang Schnitt
Also filed as: SCHNITT WOLFGANG
12 granted patents·9 pending applications·85 citations·filing 1996–2023
86Inventor score
Top patents by PatentIndex Score
21 records- 0188US6762510B2Flexible integrated monolithic circuitKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Jul 13, 2004·69 cites·10 claims
- 0271US9806034B1Semiconductor device with protected sidewalls and methods of manufacturing thereofNexperia BV·Filed 2016·Granted Oct 31, 2017·2 cites·17 claims
- 0371US8159032B2Electronic device comprising an ESD deviceSCHNITT WOLFGANG·Filed 2005·Granted Apr 17, 2012·7 cites·16 claims
- 0459US9368963B2ESD protectionNXP BV·Filed 2013·Granted Jun 14, 2016·1 cites·11 claims
- 0553US2024128314A1Semiconductor power device with improved junction termination extensionNexperia BV·Filed 2023·Application pending·0 cites
- 0651US8711532B2Integrated advance copper fuse combined with ESD/over-voltage/reverse polarity protectionPFENNIGSTORF OLAF·Filed 2011·Granted Apr 29, 2014·2 cites·19 claims
- 0751US2023223396A1Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 0848US2023230892A1Chip-scale packageNexperia BV·Filed 2023·Application pending·0 cites
- 0947US2023060216A1Wide band-gap mps diode and method of manufacturing the sameNexperia BV·Filed 2022·Application pending·0 cites
- 1041US2010230672A1Production of integrated circuits comprising different componentsNXP BV·Filed 2007·Application pending·0 cites
- 1140US11315847B2Chip scale packageNexperia BV·Filed 2018·Granted Apr 26, 2022·0 cites·15 claims
- 1240US10957685B2Multi-trench semiconductor device and method of manufacture thereofNexperia BV·Filed 2018·Granted Mar 23, 2021·0 cites·12 claims
- 1339US2007216015A1Integrated Circuit Chip With Electrostatic Discharge Protection DeviceKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
- 1438US2010230786A1Production of integrated circuits comprising semiconductor incompatible materialsNXP BV·Filed 2007·Application pending·0 cites
- 1536US8338228B2Method of detaching a thin semiconductor circuit from its baseGAKIS ANDREAS·Filed 2005·Granted Dec 25, 2012·0 cites·10 claims
- 1633US10529644B2Semiconductor deviceNexperia BV·Filed 2016·Granted Jan 7, 2020·0 cites·15 claims
- 1732US2005179077A1Monolithic integrated soi circuit with capacitorKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Application pending·0 cites
- 1830US5712557AConstant current supply circuit with stabilization based on voltage and current ratios relative to a reference voltage and a related control currentPHILIPS CORP·Filed 1996·Granted Jan 27, 1998·4 cites·8 claims
- 1929US7332778B2Semiconductor device and method of manufacturing sameSCHNITT WOLFGANG·Filed 2003·Granted Feb 19, 2008·0 cites·6 claims
- 2028US8853859B2Passivation for wafer level—chip-scale package devicesPFENNINGSTORF OLAF·Filed 2012·Granted Oct 7, 2014·0 cites·19 claims
- 2128US2004150072A1Integrated circuit having an energy-absorbing structureFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →