Inventor · disambiguated record
Wonbin Shin
Also filed as: SHIN WONBIN
0 granted patents·5 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0158US2025132202A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0256US2025140727A1Wiring structure, semiconductor package comprising the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2024194553A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0453US2024145361A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0552US2024194582A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →