Inventor · disambiguated record
Woo Kyung Sung
Also filed as: SUNG WOO-KYUNG
14 granted patents·5 pending applications·1 citations·filing 2008–2023
82Inventor score
Top patents by PatentIndex Score
19 records- 0181US11842853B2Multilayered electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 12, 2023·1 cites·14 claims
- 0268US12456579B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Oct 28, 2025·0 cites·27 claims
- 0367US12340945B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 0458US12278056B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 15, 2025·0 cites·16 claims
- 0557US12224126B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 11, 2025·0 cites·21 claims
- 0656US11996240B2Electronic component having a body and sealing thin film disposed in a microhole of the bodySAMSUNG ELECTRO MECH·Filed 2021·Granted May 28, 2024·0 cites·17 claims
- 0755US12400794B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 26, 2025·0 cites·19 claims
- 0855US12112892B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 8, 2024·0 cites·30 claims
- 0953US12255022B2Multilayer electronic component having insulating layer which includes fluorine-based organic materialSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 18, 2025·0 cites·35 claims
- 1053US12224127B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 11, 2025·0 cites·34 claims
- 1151US12374497B2Multilayer electronic component with improved reliabilitySAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 29, 2025·0 cites·27 claims
- 1251US12249461B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 11, 2025·0 cites·33 claims
- 1351US2023411074A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 1450US12354803B2Multilayer electronic component having structure for improved adhesion force and moisture protectionSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 8, 2025·0 cites·31 claims
- 1547US8391207B2Method for transmitting data in a relay system and system thereforIN JEONG SIK·Filed 2008·Granted Mar 5, 2013·0 cites·17 claims
- 1637US2013258546A1Multilayer ceramic electronic component and fabrication method thereofKIM CHAN KONG·Filed 2013·Application pending·0 cites
- 1736US2016307693A1Electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1835US2016055961A1Wire wound inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1934US2016042857A1Chip electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →