Inventor · disambiguated record
Woon Yik Yong
Also filed as: YONG WOON YIK
5 granted patents·2 citations·filing 2012–2022
65Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG5
Top patents by PatentIndex Score
5 records- 0184US11355460B1Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·2 cites·21 claims
- 0263US11817407B2Molded semiconductor package with high voltage isolationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 14, 2023·0 cites·21 claims
- 0361US11444011B2Semiconductor package with leadframe interconnection structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 0451US10872848B2Semiconductor package with leadframe interconnection structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 22, 2020·0 cites·15 claims
- 0542US9082737B2System and method for an electronic package with a fail-open mechanismINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 14, 2015·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →