Inventor · disambiguated record
Wu Chou Hsu
Also filed as: HSU WU CHOU
8 granted patents·2 pending applications·7 citations·filing 2020–2024
77Inventor score
Files withADVANCED SEMICONDUCTOR ENG10
Top patents by PatentIndex Score
10 records- 0192US11239184B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 1, 2022·3 cites·20 claims
- 0291US11342272B2Substrate structures, and methods for forming the same and semiconductor package structuresADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·12 claims
- 0370US11997798B2Package substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 28, 2024·0 cites·19 claims
- 0468US12315828B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 27, 2025·0 cites·18 claims
- 0563US11432406B2Package substrateADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 0662US12494437B2Substrate structure including different size of electronic componentADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 9, 2025·0 cites·6 claims
- 0755US11784111B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 0854US2025226364A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0952US2024112848A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1050US11335650B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 17, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →