Inventor · disambiguated record
Wu Hsiang Lee
Also filed as: LEE WU HSIANG
2 granted patents·2 pending applications·45 citations·filing 2001–2001
59Inventor score
Files withKINGPAK TECH INC1
Top patents by PatentIndex Score
4 records- 0182US6627983B2Stacked package structure of image sensorFiled 2001·Granted Sep 30, 2003·43 cites·12 claims
- 0232US6642554B2Memory module structureKINGPAK TECH INC·Filed 2001·Granted Nov 4, 2003·2 cites·8 claims
- 0331US2002096751A1Integrated circuit structure having an adhesive agent and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 0431US2002096729A1Stacked package structure of image sensorFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wu Hsiang Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →