Inventor · disambiguated record
Wuxing Xia
Also filed as: Xia Wuxing
1 granted patent·2 pending applications·0 citations·filing 2020–2022
10Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND LLC3
Top patents by PatentIndex Score
3 records- 0152US12394745B2Semiconductor device including bonding coversSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Aug 19, 2025·0 cites·22 claims
- 0243US2024090130A1Leadframe mounting with lead insertion for lead wall bondingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 0338US2022020717A1Strengthened wire-bondSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →