Inventor · disambiguated record
Xiaomei Bu
Also filed as: BU XIAOMEI
7 granted patents·117 citations·filing 2003–2013
86Inventor score
Files withCHARTERED SEMICONDUCTOR MFG3GLOBALFOUNDRIES SG PTE LTD2AGENCY SCIENCE TECH & RES1ZHANG FAN1
Top patents by PatentIndex Score
7 records- 0187US7585768B2Combined copper plating method to improve gap fillCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted Sep 8, 2009·14 cites·12 claims
- 0287US7094669B2Structure and method of liner air gap formationCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Aug 22, 2006·46 cites·29 claims
- 0376US7989338B2Grain boundary blocking for stress migration and electromigration improvement in CU interconnectsGLOBALFOUNDRIES SG PTE LTD·Filed 2005·Granted Aug 2, 2011·8 cites·22 claims
- 0474US7224060B2Integrated circuit with protective moatCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted May 29, 2007·25 cites·24 claims
- 0572US9054107B2Reliable interconnect for semiconductor deviceGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 0672US6913994B2Method to form Cu/OSG dual damascene structure for high performance and reliable interconnectsAGENCY SCIENCE TECH & RES·Filed 2003·Granted Jul 5, 2005·20 cites·30 claims
- 0768US8598031B2Reliable interconnect for semiconductor deviceZHANG FAN·Filed 2009·Granted Dec 3, 2013·2 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →