Inventor · disambiguated record
Xianming Chen
Also filed as: CHEN XIANMING
85 granted patents·44 pending applications·55 citations·filing 2013–2025
98Inventor score
Files withZHUHAI ACCESS SEMICONDUCTOR CO LTD63ZTE CORP50XIAN ZHONGXING NEW SOFTWARE CO LTD8ZHUHAI YUEXIN SEMICONDUCTOR LLC3NANTONG ACCESS SEMICONDUCTOR CO LTD2
Top patents by PatentIndex Score
129 records- 0194US11770859B2Information transmission method, and base station, terminal and computer-readable storage mediumZTE CORP·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 0292US12256265B2Data transmission method and apparatus, and storage mediumXIAN ZHONGXING NEW SOFTWARE CO LTD·Filed 2022·Granted Mar 18, 2025·2 cites·12 claims
- 0392US11114310B1Embedded packaging method capable of realizing heat dissipationZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Sep 7, 2021·4 cites·7 claims
- 0491US12302508B2Temporary carrier and method for manufacturing coreless substrate therebyZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 13, 2025·2 cites·8 claims
- 0590US10952033B2Multicast transmission method and apparatus, and computer storage mediumZTE CORP·Filed 2019·Granted Mar 16, 2021·5 cites·18 claims
- 0689US11284446B2Information transmission method, and base station, terminal and computer-readable storage mediumZTE CORP·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 0788US11356215B2System and method for transmitting a signalZTE CORP·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 0887US10862530B2Method and device for transmitting positioning reference signal, and computer storage mediumZTE CORP·Filed 2016·Granted Dec 8, 2020·6 cites·9 claims
- 0984US9425928B2Data transmission method and deviceZTE CORP·Filed 2013·Granted Aug 23, 2016·7 cites·20 claims
- 1083US11177853B2Information transmission method and apparatusXIAN ZHONGXING NEW SOFTWARE CO LTD·Filed 2016·Granted Nov 16, 2021·4 cites·33 claims
- 1183US10433341B2Random access response message sending method and nodeZTE CORP·Filed 2016·Granted Oct 1, 2019·4 cites·19 claims
- 1280US10554367B2Narrowband uplink resource configurationZTE CORP·Filed 2018·Granted Feb 4, 2020·3 cites·15 claims
- 1379US11381434B2Signal transmitting method, device and system, and storage mediumZTE CORP·Filed 2018·Granted Jul 5, 2022·2 cites·19 claims
- 1479US11201776B2System and method for transmitting a signalZTE CORP·Filed 2019·Granted Dec 14, 2021·2 cites·8 claims
- 1577US11057899B2Method and apparatus for resource allocation and determinationZTE CORP·Filed 2017·Granted Jul 6, 2021·2 cites·18 claims
- 1673US9718937B2Inherent flame retardant rigid polyurethane foamUNIV XIAMEN·Filed 2014·Granted Aug 1, 2017·1 cites·9 claims
- 1772US11769733B2Package substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·3 claims
- 1871US12166700B2System and method for transmitting a signalZTE CORP·Filed 2022·Granted Dec 10, 2024·0 cites·15 claims
- 1971US9781739B2Method, base station, terminal and system for system information transmissionZTE CORP·Filed 2014·Granted Oct 3, 2017·2 cites·21 claims
- 2071US2025329629A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 2170US12148676B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·9 claims
- 2270US12040272B2Connector for implementing multi-faceted interconnectionZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·13 claims
- 2370US11882536B2System and method for transmitting a signalZTE CORP·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 2470US11822121B2Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 21, 2023·0 cites·7 claims
- 2568US2025212337A1Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 2666US11682621B2Connector for implementing multi-faceted interconnectionZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·6 claims
- 2766US10666484B2Method and apparatus for transmission of synchronization signalZTE CORP·Filed 2016·Granted May 26, 2020·1 cites·10 claims
- 2866US10448430B2Group based random access method device and systemZTE CORP·Filed 2016·Granted Oct 15, 2019·1 cites·18 claims
- 2965US12279377B2Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·7 claims
- 3065US11722854B2Multicast transmission method and apparatus, and computer storage mediumZTE CORP·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 3165US11689333B2Signal transmission method and systemZTE CORP·Filed 2021·Granted Jun 27, 2023·0 cites·12 claims
- 3264US12412843B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·5 claims
- 3364US12230581B2Multi-device graded embedding package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·12 claims
- 3464US11503712B2Passive device packaging structure embedded in glass medium and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 3564US11399440B2Method for manufacturing coreless substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·6 claims
- 3664US2025149461A1Multi-device graded embedding package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 3763US11515258B2Package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·9 claims
- 3863US10455448B2Random access signalling resending method and apparatusZTE CORP·Filed 2015·Granted Oct 22, 2019·1 cites·9 claims
- 3962US11924012B2Signal transmitting method, device, and storage mediumZTE CORP·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 4062US11854920B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·9 claims
- 4162US11115252B2Signal transmission method and systemZTE CORP·Filed 2020·Granted Sep 7, 2021·0 cites·19 claims
- 4262US2025112111A1Fan-out panel level packaging structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 4361US12040526B2Method for manufacturing embedded package structure having air resonant cavityZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·14 claims
- 4461US11579362B2Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·13 claims
- 4561US2023282565A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 4661US2025349463A1Embedding method and embedded structure for magnetic transformer, electronic device and storage mediumZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2024·Application pending·0 cites
- 4759US12476230B2Embedded packaging structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·7 claims
- 4859US2024332224A1Embedded magnetic device integrated structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 4958US11569177B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·7 claims
- 5058US11336404B2Data transmission method and apparatusXIAN ZHONGXING NEW SOFTWARE CO LTD·Filed 2018·Granted May 17, 2022·0 cites·7 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →