Inventor · disambiguated record
Xiping He
Also filed as: HE XIPING
3 granted patents·2 pending applications·110 citations·filing 2001–2018
73Inventor score
Top patents by PatentIndex Score
5 records- 0189US6620651B2Adhesive wafers for die attach applicationNAT STARCH CHEM INVEST·Filed 2001·Granted Sep 16, 2003·85 cites·3 claims
- 0280US10827660B2Conductive composition for low frequency EMI shieldingHenkel IP & Holding GmbH·Filed 2018·Granted Nov 3, 2020·4 cites·18 claims
- 0366US7186945B2Sprayable adhesive material for laser marking semiconductor wafers and diesNAT STARCH CHEM INVEST·Filed 2003·Granted Mar 6, 2007·21 cites·2 claims
- 0437US2006134901A1Hot-Melt Underfill Composition and Methos of ApplicationNAT STARCH CHEM INVEST·Filed 2005·Application pending·0 cites
- 0533US2004158008A1Room temperature printable adhesive pasteHE XIPING·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Xiping He files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →