Inventor · disambiguated record
Xiyu Hu
Also filed as: HU XIYU
0 granted patents·6 pending applications·0 citations·filing 2022–2024
Technology areasH10W
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0156US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 0256US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 0355US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0455US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US2025006645A1Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulationINTEL CORP·Filed 2023·Application pending·0 cites
- 0652US2024222259A1Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages having silicon nitride adhesion promotersINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →