Inventor · disambiguated record
Xiao Lin Kang
Also filed as: Kang Xiao Lin
3 granted patents·2 pending applications·1 citations·filing 2018–2023
50Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC5
Top patents by PatentIndex Score
5 records- 0167US12283559B2Copper wire bond on gold bump on semiconductor die bond padTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 22, 2025·0 cites·24 claims
- 0262US10692835B2Ball bond attachment for a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 23, 2020·1 cites·17 claims
- 0354US11515275B2Copper wire bond on gold bump on semiconductor die bond padTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 29, 2022·0 cites·29 claims
- 0445US2024250060A1Capillary for stitch bondTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0540US2023275060A1Leaded semiconductor package with lead mold flash reductionTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →