Inventor · disambiguated record
Xiangnan Li
Also filed as: LI XIANGNAN
6 granted patents·5 pending applications·1 citations·filing 2015–2024
65Inventor score
Files withELITE ELECTRONIC MAT ZHONGSHAN CO LTD4ELITE ELECTRONIC MAT (ZHONG SHAN) CO LTD2MICROSOFT TECHNOLOGY LICENSING LLC2ELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD1GUANGZHOU BAIYUN CHEMICAL IND CO LTD1
Top patents by PatentIndex Score
11 records- 0171US2025139091A1Click-to-script reflectionMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Application pending·0 cites
- 0270US9867287B2Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereofELITE ELECTRONIC MAT (ZHONG SHAN) CO LTD·Filed 2015·Granted Jan 9, 2018·1 cites·8 claims
- 0368US12152144B2Copolymer, method of preparing the same, resin composition and article made therefromELITE ELECTRONIC MAT ZHONGSHAN CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·17 claims
- 0467US2025136805A1Copolymer, method of preparing the same, resin composition, and product of the sameELITE ELECTRONIC MAT ZHONGSHAN CO LTD·Filed 2023·Application pending·0 cites
- 0567US2025361381A1Resin composition and article made therefromELITE ELECTRONIC MAT ZHONGSHAN CO LTD·Filed 2024·Application pending·0 cites
- 0665US11820894B2Resin composition and article made therefromELITE ELECTRONIC MAT ZHONGSHAN CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·15 claims
- 0763US12164516B2Click-to-script reflectionMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 0853US12192278B2Systems, methods, and apparatus for remote data transfers to memorySAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·19 claims
- 0938US2022106484A1Continuous Production Device and Method for Silane-Modified Sealing MaterialGUANGZHOU BAIYUN CHEMICAL IND CO LTD·Filed 2019·Application pending·0 cites
- 1037US9872382B2Low dielectric composite material and laminate and printed circuit board thereofELITE ELECTRONIC MAT (ZHONG SHAN) CO LTD·Filed 2015·Granted Jan 16, 2018·0 cites·11 claims
- 1123US2016165714A1Multi-layer printed circuit boards with low warpageELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →