Inventor · disambiguated record
Xian Li
Also filed as: LI XIAN · Li xian-bin
18 granted patents·1 pending application·59 citations·filing 2006–2024
92Inventor score
Files withVISHAY GEN SEMICONDUCTOR LLC5TYCO ELECTRONICS SHANGHAI CO LTD4CHOU TA-TE3BEIJING BOE OPTOELECTRONICS TECH CO LTD1BEIJING DAJIA INTERNET INFORMATION TECH CO LTD1
Top patents by PatentIndex Score
19 records- 0185US8910117B2Customizing and performing policy in version controlLI XIAN·Filed 2007·Granted Dec 9, 2014·19 cites·20 claims
- 0281US9945914B2Systems, apparatus, and methods of nonlinear terahertz (THz) magnetic resonance measurementHwang Harold Young·Filed 2017·Granted Apr 17, 2018·3 cites·23 claims
- 0376US8048714B2Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilitiesVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted Nov 1, 2011·8 cites·11 claims
- 0474US10495703B2Systems, apparatus, and methods of nonlinear terahertz (THz) magnetic resonance measurementMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Dec 3, 2019·1 cites·20 claims
- 0572US10665991B2Electrical connector with a locking structureTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2018·Granted May 26, 2020·3 cites·18 claims
- 0666US10700460B2Electrical connectorTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2018·Granted Jun 30, 2020·2 cites·20 claims
- 0764US8421214B2Semiconductor device and method for manufacturing a semiconductor deviceCHOU TA-TE·Filed 2007·Granted Apr 16, 2013·3 cites·13 claims
- 0861US2025219329A1Electrical connector and connector assemblyLOTES CO LTD·Filed 2024·Application pending·0 cites
- 0960US7719096B2Semiconductor device and method for manufacturing a semiconductor deviceVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted May 18, 2010·2 cites·18 claims
- 1059US8269338B2Semiconductor device having improved heat dissipation capabilitiesCHOU TA-TE·Filed 2007·Granted Sep 18, 2012·2 cites·14 claims
- 1155US12426834B2Unlocking method and intelligent lock based on vein input and identificationIDLESPACE TECH COMPANY CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·8 claims
- 1254USD573116SBridge rectifier package with heat sinkVISHAY GEN SEMICONDUCTOR LLC·Filed 2006·Granted Jul 15, 2008·7 cites·1 claims
- 1350US8865526B2Semiconductor device and method for manufacturing a semiconductor deviceVISHAY GEN SEMICONDUCTOR LLC·Filed 2013·Granted Oct 21, 2014·0 cites·5 claims
- 1448US11355543B2Packaging unit, component packaging structure and preparation method thereofBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2018·Granted Jun 7, 2022·0 cites·9 claims
- 1548USD616387SBridge rectifier packageVISHAY GEN SEMICONDUCTOR LLC·Filed 2008·Granted May 25, 2010·5 cites·1 claims
- 1644US10404016B2Electric connection assemblyTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·13 claims
- 1744USD654881SBridge rectifier package with heat sinkCHOU TA-TE·Filed 2010·Granted Feb 28, 2012·4 cites·1 claims
- 1842US11216523B2Method, system, server and intelligent terminal for aggregating and displaying commentsBEIJING DAJIA INTERNET INFORMATION TECH CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·15 claims
- 1942US9666960B2Power connector for connecting a conductive wire to a circuit boardTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2016·Granted May 30, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →