Inventor · disambiguated record
Xizhou Li
Also filed as: LI XIZHOU
2 granted patents·2 citations·filing 2010–2012
37Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0149US9349615B2SiP system-integration IC chip package and manufacturing method thereofXIE JIANYOU·Filed 2010·Granted May 24, 2016·1 cites·4 claims
- 0249US9312242B2Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method thereforTIANSHUI HUATIAN TECHNOLOGY CO·Filed 2012·Granted Apr 12, 2016·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →