Inventor · disambiguated record
Xiaojing Liao
Also filed as: LIAO XIAOJING
8 granted patents·3 pending applications·5 citations·filing 2013–2024
75Inventor score
Files withHUAWEI TECH CO LTD5HUAWEI DIGITAL POWER TECH CO LTD4JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD1UNIV INDIANA RES & TECH CORP1
Top patents by PatentIndex Score
11 records- 0181US11538774B2Wireless transmission module and manufacturing methodHUAWEI TECH CO LTD·Filed 2020·Granted Dec 27, 2022·2 cites·18 claims
- 0266US10880330B2Systems and methods for detection of infected websitesUNIV INDIANA RES & TECH CORP·Filed 2018·Granted Dec 29, 2020·2 cites·20 claims
- 0359US12075558B2Printed circuit boardHUAWEI DIGITAL POWER TECH CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·16 claims
- 0459US2024321761A1Power module, power conversion device, and vehicleHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0557US2024321719A1Packaged Device, Power Module, and Electronic ApparatusHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0655US12354967B2Chip package assembly, electronic device, and preparation method of chip package assemblyHUAWEI TECH CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·17 claims
- 0754US12224146B2Embedded substrate, circuit board assembly, and electronic deviceHUAWEI TECH CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·23 claims
- 0852US12482724B2Package structure and package systemHUAWEI TECH CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·18 claims
- 0952US12396093B2Power supply module and power deviceHUAWEI DIGITAL POWER TECH CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 1051US9627303B2Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological methodJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted Apr 18, 2017·1 cites·20 claims
- 1148US2023299018A1Package substrate and communication deviceHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →