Inventor · disambiguated record
Xiao-Chun Mu
Also filed as: MU XIAO-CHUN
27 granted patents·1 pending application·2,876 citations·filing 1986–2004
98Inventor score
Top patents by PatentIndex Score
28 records- 0199US6902950B2Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2002·Granted Jun 7, 2005·251 cites·16 claims
- 0299US6461895B1Process for making active interposer for high performance packaging applicationsINTEL CORP·Filed 2000·Granted Oct 8, 2002·353 cites·23 claims
- 0399US6423570B1Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2000·Granted Jul 23, 2002·352 cites·9 claims
- 0497US6964889B2Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2002·Granted Nov 15, 2005·153 cites·16 claims
- 0597US5612254AMethods of forming an interconnect on a semiconductor substrateINTEL CORP·Filed 1992·Granted Mar 18, 1997·478 cites·22 claims
- 0697US4980018APlasma etching process for refractory metal viasINTEL CORP·Filed 1989·Granted Dec 25, 1990·240 cites·26 claims
- 0796US6586822B1Integrated core microelectronic packageINTEL CORP·Filed 2000·Granted Jul 1, 2003·179 cites·19 claims
- 0896US5350484AMethod for the anisotropic etching of metal films in the fabrication of interconnectsINTEL CORP·Filed 1992·Granted Sep 27, 1994·275 cites·52 claims
- 0995US6586836B1Process for forming microelectronic packages and intermediate structures formed therewithINTEL CORP·Filed 2000·Granted Jul 1, 2003·111 cites·26 claims
- 1091US6365962B1Flip-chip on flex for high performance packaging applicationsINTEL CORP·Filed 2000·Granted Apr 2, 2002·47 cites·24 claims
- 1189US6600364B1Active interposer technology for high performance CMOS packaging applicationINTEL CORP·Filed 1999·Granted Jul 29, 2003·74 cites·17 claims
- 1281US6798003B2Reliable adhesion layer interface structure for polymer memory electrode and method of making sameINTEL CORP·Filed 2001·Granted Sep 28, 2004·20 cites·22 claims
- 1380US5792522AHigh density plasma physical vapor depositionINTEL CORP·Filed 1996·Granted Aug 11, 1998·65 cites·29 claims
- 1477US6756620B2Low-voltage and interface damage-free polymer memory deviceINTEL CORP·Filed 2001·Granted Jun 29, 2004·21 cites·18 claims
- 1575US6624457B2Stepped structure for a multi-rank, stacked polymer memory device and method of making sameINTEL CORP·Filed 2001·Granted Sep 23, 2003·18 cites·22 claims
- 1672US4897154APost dry-etch cleaning method for restoring wafer propertiesIBM·Filed 1986·Granted Jan 30, 1990·39 cites·19 claims
- 1770US6960479B2Stacked ferroelectric memory device and method of making sameINTEL CORP·Filed 2001·Granted Nov 1, 2005·15 cites·15 claims
- 1869US6524887B2Embedded recess in polymer memory package and method of making sameINTEL CORP·Filed 2001·Granted Feb 25, 2003·15 cites·27 claims
- 1969US5035768ANovel etch back process for tungsten contact/via fillingINTEL CORP·Filed 1990·Granted Jul 30, 1991·44 cites·4 claims
- 2068US5343524AIntelligent security deviceMU XIAO CHUN·Filed 1991·Granted Aug 30, 1994·71 cites·7 claims
- 2165US6858862B2Discrete polymer memory array and method of making sameINTEL CORP·Filed 2001·Granted Feb 22, 2005·13 cites·29 claims
- 2256US6312830B1Method and an apparatus for forming an under bump metallization structureINTEL CORP·Filed 1999·Granted Nov 6, 2001·17 cites·6 claims
- 2352US7018853B1Stepped structure for a multi-rank, stacked polymer memory device and method of making sameINTEL CORP·Filed 2003·Granted Mar 28, 2006·2 cites·17 claims
- 2452US6461954B1Method and an apparatus for forming an under bump metallization structureINTEL CORP·Filed 2001·Granted Oct 8, 2002·4 cites·9 claims
- 2545US6952017B2Low-voltage and interface damage-free polymer memory deviceINTEL CORP·Filed 2004·Granted Oct 4, 2005·2 cites·4 claims
- 2643US7078240B2Reliable adhesion layer interface structure for polymer memory electrode and method of making sameINTEL CORP·Filed 2004·Granted Jul 18, 2006·4 cites·9 claims
- 2742US5167760AEtchback process for tungsten contact/via fillingINTEL CORP·Filed 1991·Granted Dec 1, 1992·13 cites·1 claims
- 2834US2002070443A1Microelectronic package having an integrated heat sink and build-up layersFiled 2000·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Xiao-Chun Mu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →