Inventor · disambiguated record
Xingshou Pang
Also filed as: PANG XINGSHOU
12 granted patents·3 pending applications·32 citations·filing 2011–2021
86Inventor score
Top patents by PatentIndex Score
15 records- 0192US9324637B1Quad flat non-leaded semiconductor package with wettable flankFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Apr 26, 2016·11 cites·14 claims
- 0287US10515880B2Lead frame with bendable leadsNXP USA INC·Filed 2019·Granted Dec 24, 2019·5 cites·20 claims
- 0386US10037935B1Lead frame with dummy leads for burr mitigation during encapsulationNXP USA INC·Filed 2017·Granted Jul 31, 2018·6 cites·20 claims
- 0477US10446476B2Packaged integrated circuit having stacked die and method for thereforNXP USA INC·Filed 2018·Granted Oct 15, 2019·3 cites·17 claims
- 0571US8692387B2Stacked die semiconductor packageQIU SHUNAN·Filed 2012·Granted Apr 8, 2014·5 cites·10 claims
- 0670US10181434B1Lead frame for integrated circuit device having J-leads and gull wing leadsNXP USA INC·Filed 2018·Granted Jan 15, 2019·1 cites·16 claims
- 0762US9443746B2Floating mold tool for semicondcutor packagingBAI ZHIGANG·Filed 2014·Granted Sep 13, 2016·1 cites·5 claims
- 0851US11784112B2Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit packageNXP USA INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 0950US11417541B2Protection from metal migration on IC packagesNXP USA INC·Filed 2019·Granted Aug 16, 2022·0 cites·17 claims
- 1049US9416002B2Packaged semiconductor sensor device with lidXU NAN·Filed 2014·Granted Aug 16, 2016·0 cites·8 claims
- 1145US2016056097A1Semiconductor device with inspectable solder jointsBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 1243US10217700B1Lead frame for integrated circuit device having J-leads and Gull Wing leadsNXP USA INC·Filed 2018·Granted Feb 26, 2019·0 cites·13 claims
- 1339US2012193737A1Mram device and method of assembling samePANG XINGSHOU·Filed 2011·Application pending·0 cites
- 1438US2013049180A1Qfn device and lead frame thereforXU NAN·Filed 2012·Application pending·0 cites
- 1537US8481369B2Method of making semiconductor package with improved standoffLUO JUNHUA·Filed 2011·Granted Jul 9, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →