Inventor · disambiguated record

Xiaopeng Qu

Also filed as: QU XIAOPENG

25 granted patents·3 pending applications·29 citations·filing 2017–2024

93Inventor score

Technology areasH10W H05K G01R H10P

Files withMICRON TECHNOLOGY INC28

Top patents by PatentIndex Score

28 records

0197US11011449B1Apparatus and method for dissipating heat in multiple semiconductor device modulesMICRON TECHNOLOGY INC·Filed 2020·Granted May 18, 2021·8 cites·22 claims
0296US11515171B2Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·4 cites·37 claims
0393US11984440B2Semiconductor devices, semiconductor device packages, electronic systems including same, and related methodsMICRON TECHNOLOGY INC·Filed 2021·Granted May 14, 2024·2 cites·16 claims
0490US11617284B2Assemblies including heat dispersing elements and related systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 28, 2023·2 cites·19 claims
0589US11211364B1Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·2 cites·20 claims
0688US11348857B2Lidded microelectronic device packages and related systems, apparatus, and methods of manufactureMICRON TECHNOLOGY INC·Filed 2020·Granted May 31, 2022·2 cites·17 claims
0785US11348875B2Semiconductor devices with flexible connector arrayMICRON TECHNOLOGY INC·Filed 2020·Granted May 31, 2022·2 cites·22 claims
0883US11239133B2Apparatus and method for dissipating heat in multiple semiconductor device modulesMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 1, 2022·1 cites·20 claims
0978US11587918B2Semiconductor devices, semiconductor device packages, electronic systems including same, and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 21, 2023·2 cites·16 claims
1078US10952352B2Assemblies including heat dispersing elements and related systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 16, 2021·2 cites·28 claims
1178US2024339437A1Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1273US12015011B2Semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 18, 2024·0 cites·18 claims
1372US12243801B2Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·19 claims
1472US10672679B2Heat spreaders for multiple semiconductor device modulesMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·1 cites·20 claims
1571US12159811B2Lidded microelectronic device packages and related systems, apparatus, and methods of manufactureMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
1670US12078672B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
1769US11557526B2Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 17, 2023·0 cites·18 claims
1868US11011452B2Heat spreaders for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 18, 2021·1 cites·23 claims
1967US12028962B2Thermal management of circuit boardsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 2, 2024·0 cites·15 claims
2067US11908803B2Semiconductor devices with flexible connector arrayMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·0 cites·11 claims
2163US11270924B2Heat spreaders for multiple semiconductor device modulesMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 8, 2022·0 cites·22 claims
2260US11915997B2Thermal management of GPU-HBM package by microchannel integrated substrateMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 27, 2024·0 cites·10 claims
2360US11419239B2Thermal management of circuit boardsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 16, 2022·0 cites·15 claims
2460US11372043B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 28, 2022·0 cites·17 claims
2559US11385281B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 12, 2022·0 cites·15 claims
2659US2021225733A1Heat spreaders for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
2753US10653033B1Kits for enhanced cooling of components of computing devices and related computing devices, systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 12, 2020·0 cites·23 claims
2845US2021272872A1Thermal management materials for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →