Inventor · disambiguated record
Xiaoxuan Sun
Also filed as: SUN XIAOXUAN
2 granted patents·8 pending applications·0 citations·filing 2020–2025
27Inventor score
Top patents by PatentIndex Score
10 records- 0174US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 0266US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 0362US2025167062A1Microelectronic structures including bridgesINTEL CORP·Filed 2025·Application pending·0 cites
- 0457US12243792B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Mar 4, 2025·0 cites·20 claims
- 0551US2024222283A1Methods and apparatus to prevent over-etch in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0650US2022154800A1Motion sensor module and movable platformSZ DJI TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 0749US2023317653A1Hybrid bonding a die to a substrate with vias connecting metal pads on both sides of the dieINTEL CORP·Filed 2022·Application pending·0 cites
- 0846US2023093186A1Semiconductor device having solder-free die connection to redistribution layerINTEL CORP·Filed 2021·Application pending·0 cites
- 0946US2023266775A1Gimbal and gimbal control methodSZ DJI TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1040US2022270976A1Microelectronic assemblies including bridgesSUN XIAOXUAN·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →