Inventor · disambiguated record
Xiaochun Tan
Also filed as: TAN XIAOCHUN
37 granted patents·8 pending applications·336 citations·filing 2008–2025
97Inventor score
Files withSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD29HEFEI SMAT TECH CO LTD6MICROSOFT CORP3SHANGHAI KAIHONG TECHNOLOGY CO3CHEN WEI2
Top patents by PatentIndex Score
45 records- 0196USD606081SUser interface for a display screenMICROSOFT CORP·Filed 2008·Granted Dec 15, 2009·89 cites·1 claims
- 0295US8866283B2Chip package structure and method of making the sameCHEN WEI·Filed 2012·Granted Oct 21, 2014·20 cites·12 claims
- 0394US9373567B2Lead frame, manufacture method and package structure thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2014·Granted Jun 21, 2016·20 cites·10 claims
- 0494USD606082SUser interface for a display screenMICROSOFT CORP·Filed 2008·Granted Dec 15, 2009·72 cites·1 claims
- 0592USD606083SUser interface for a display screenMICROSOFT CORP·Filed 2008·Granted Dec 15, 2009·51 cites·1 claims
- 0687US10734249B2Package structure and method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Aug 4, 2020·4 cites·16 claims
- 0786US10763241B2Stacked package structure and stacked packaging method for chipSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Sep 1, 2020·4 cites·19 claims
- 0886US9324633B2Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2014·Granted Apr 26, 2016·7 cites·19 claims
- 0985US8836093B2Lead frame and flip chip package device thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2012·Granted Sep 16, 2014·7 cites·11 claims
- 1083US9024440B2Flip-chip package structure and method for an integrated switching power supplySILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Granted May 5, 2015·5 cites·19 claims
- 1183US8866273B2Lead frame and semiconductor package structure thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2012·Granted Oct 21, 2014·6 cites·10 claims
- 1282US7745261B2Chip scale package fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2008·Granted Jun 29, 2010·11 cites·15 claims
- 1380US9136207B2Chip packaging structure of a plurality of assembliesSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Granted Sep 15, 2015·5 cites·13 claims
- 1478US9123629B2Chip package and method for forming the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2014·Granted Sep 1, 2015·4 cites·9 claims
- 1577US7517726B1Wire bonded chip scale package fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2008·Granted Apr 14, 2009·9 cites·20 claims
- 1676US10319608B2Package structure and method therofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Jun 11, 2019·2 cites·19 claims
- 1775US12418000B2Stacked package structure and stacked packaging method for chipSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2022·Granted Sep 16, 2025·0 cites·17 claims
- 1874US9780081B2Chip package structure and manufacturing method thereforSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Oct 3, 2017·2 cites·20 claims
- 1974US7713784B2Thin quad flat package with no leads (QFN) fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO·Filed 2008·Granted May 11, 2010·6 cites·12 claims
- 2073US8294256B2Chip package structure and method of making the sameCHEN WEI·Filed 2010·Granted Oct 23, 2012·3 cites·9 claims
- 2169US8853838B2Lead frame and flip packaging device thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Granted Oct 7, 2014·2 cites·8 claims
- 2267US11462510B2Stacked package structure and stacked packaging method for chipSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 2367US8008128B2Thin quad flat package with no leads (QFN) fabrication methodsSHANGHAI KAIHONG TECHNOLOGY CO LTD·Filed 2010·Granted Aug 30, 2011·4 cites·9 claims
- 2466US11735503B2Method of manufacturing chip packaging structure with dissipation layer, flange and sealing pinHEFEI SMAT TECH CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 2563US9595453B2Chip package method and package assemblySILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Mar 14, 2017·1 cites·10 claims
- 2663US9136248B2Multi-chip stacked package and method for forming the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2014·Granted Sep 15, 2015·1 cites·11 claims
- 2762US9054088B2Multi-component chip packaging structureSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Granted Jun 9, 2015·1 cites·11 claims
- 2862US2025218919A1Semiconductor package structure and packaging methodHEFEI SMAT TECH CO LTD·Filed 2024·Application pending·0 cites
- 2957US9735122B2Flip chip package structure and fabrication process thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2017·Granted Aug 15, 2017·0 cites·20 claims
- 3056US9653355B2Flip chip package structure and fabrication process thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Granted May 16, 2017·0 cites·16 claims
- 3154US2023386959A1Chip heat dissipating structure, process and semiconductor deviceHEFEI SMAT TECH CO LTD·Filed 2023·Application pending·0 cites
- 3253US11239140B2Chip packaging structure with heat dissipation layer, flange and sealing pinHEFEI SMAT TECH CO LTD·Filed 2018·Granted Feb 1, 2022·0 cites·9 claims
- 3352US10741481B2Integrated package assembly for switching regulatorSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2018·Granted Aug 11, 2020·0 cites·12 claims
- 3452US2025357408A1Stacked chip package structure and method for forming the sameHEFEI SMAT TECH CO LTD·Filed 2025·Application pending·0 cites
- 3549US2025279337A1Stacked chip package structure and method for forming the sameHEFEI SMAT TECH CO LTD·Filed 2025·Application pending·0 cites
- 3648US9245872B2Flip-chip package structure and method for an integrated switching power supplySILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Jan 26, 2016·0 cites·20 claims
- 3746US2015171064A1Package assembly and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2014·Application pending·0 cites
- 3845US10043738B2Integrated package assembly for switching regulatorSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Aug 7, 2018·0 cites·9 claims
- 3945US9786521B2Chip package method for reducing chip leakage currentSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Oct 10, 2017·0 cites·10 claims
- 4044US9129947B2Multi-chip packaging structure and methodSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Granted Sep 8, 2015·0 cites·14 claims
- 4144US2011281398A1Thin quad flat package with no leads (qfn) fabrication methodsTAN XIAOCHUN·Filed 2011·Application pending·0 cites
- 4243US2014097542A1Flip packaging deviceSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Application pending·0 cites
- 4343US2014120661A1Flip chip packaging methodSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2013·Application pending·0 cites
- 4440US10128221B2Package assembly having interconnect for stacked electronic devices and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Nov 13, 2018·0 cites·10 claims
- 4540US9699918B2Package assembly and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →