Inventor · disambiguated record
Xinchao Wang
Also filed as: WANG XINCHAO
6 granted patents·6 pending applications·3 citations·filing 2006–2019
67Inventor score
Files withJIANGSU CHANGJIANG ELECTRONICS7CORECHEM CORP HOLDING CO LTD1ECOLE POLYTECHNIQUE FED DE LAUSANNE (EPFL)1GE MED SYS GLOBAL TECH CO LLC1GEN ELECTRIC1
Top patents by PatentIndex Score
12 records- 0163US9209117B2No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Dec 8, 2015·2 cites·16 claims
- 0252US9794525B2Systems and methods for tracking interacting objectsECOLE POLYTECHNIQUE FED DE LAUSANNE (EPFL)·Filed 2015·Granted Oct 17, 2017·1 cites·16 claims
- 0350US2023064344A1Fluorosilicone surfactant, preparation method therefor and application thereofCORECHEM CORP HOLDING CO LTD·Filed 2019·Application pending·0 cites
- 0441US9209115B2Quad flat no-lead (QFN) packaging structure and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Dec 8, 2015·0 cites·13 claims
- 0541US2008258273A1Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0641US2008315412A1Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0741US2013144173A1Ultrasonic probe device and a detection method thereofGE MED SYS GLOBAL TECH CO LLC·Filed 2012·Application pending·0 cites
- 0840US9362214B2Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Jun 7, 2016·0 cites·6 claims
- 0940US9105622B2Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Aug 11, 2015·0 cites·18 claims
- 1040US2008285251A1Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the SameJIANGSU CHANGIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 1139US9252113B2No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Feb 2, 2016·0 cites·6 claims
- 1233US2017135674A1Wireless ultrasonic probe and ultrasonic machineGEN ELECTRIC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →