Inventor · disambiguated record
Xinpeng Wang
Also filed as: WANG XINPENG
41 granted patents·14 pending applications·52 citations·filing 2007–2025
96Inventor score
Files withCHENGDU BOE OPTOELECT TECH CO9SEMICONDUCTOR MFG INT SHANGHAI8SEMICONDUCTOR MFG INT SHANGHAI CORP6UNIV QINGDAO TECHNOLOGY6WANG XINPENG5
Top patents by PatentIndex Score
55 records- 0188US11839018B2Flexible printed circuit board and display touch apparatusCHENGDU BOE OPTOELECT TECH CO·Filed 2020·Granted Dec 5, 2023·2 cites·19 claims
- 0288US8772148B1Metal gate transistors and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI·Filed 2013·Granted Jul 8, 2014·11 cites·13 claims
- 0383US8822234B2Method of fabricating a semiconductor deviceSEMICONDUCTOR MFG INT SHANGHAI·Filed 2012·Granted Sep 2, 2014·6 cites·20 claims
- 0482US9087975B2Resistive memory arrangement and a method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2013·Granted Jul 21, 2015·4 cites·5 claims
- 0580US8502289B2Double gate transistor and method of fabricating the sameWANG XINPENG·Filed 2011·Granted Aug 6, 2013·6 cites·57 claims
- 0677US9441940B2Piezoresistive boron doped diamond nanowireUCHICAGO ARGONNE LLC·Filed 2015·Granted Sep 13, 2016·2 cites·18 claims
- 0777US8877651B2Semiconductor device and manufacturing method involving multilayer contact etch stopHAN QIUHUA·Filed 2011·Granted Nov 4, 2014·6 cites·14 claims
- 0871US12312431B1Method for preparing styrene-acrylate siloxane interpenetrating polymer network composite emulsionUNIV QINGDAO TECHNOLOGY·Filed 2023·Granted May 27, 2025·0 cites·8 claims
- 0971US9023224B2Method of forming a spacer patterning maskSEMICONDUCTOR MFG INT SHANGHAI·Filed 2014·Granted May 5, 2015·2 cites·14 claims
- 1071US8877577B2Semiconductor device and manufacturing method thereofWANG XINPENG·Filed 2012·Granted Nov 4, 2014·3 cites·12 claims
- 1170US9696222B2Piezoresistive boron doped diamond nanowireUCHICAGO ARGONNE LLC·Filed 2016·Granted Jul 4, 2017·1 cites·17 claims
- 1270US8673776B2Method for manufacturing semiconductor device having interlayer dielectric layers and a gate contactWANG XINPENG·Filed 2011·Granted Mar 18, 2014·3 cites·9 claims
- 1365US9093317B2Semiconductor device and fabrication methodSEMICONDUCTOR MFG INT BEIJING·Filed 2014·Granted Jul 28, 2015·2 cites·15 claims
- 1464US9490362B2Semiconductor device production method and semiconductor deviceUNISANTIS ELECT SINGAPORE PTE·Filed 2015·Granted Nov 8, 2016·1 cites·4 claims
- 1563US9111871B2Semiconductor structure and method for forming the sameSEMICONDUCTOR MFG INT SHANGHAI·Filed 2014·Granted Aug 18, 2015·1 cites·20 claims
- 1660US2024384055A1Graphene oxide (go)-modified styrene-acrylic pickering emulsion and composite emulsion, and preparation methods and useUNIV QINGDAO TECHNOLOGY·Filed 2022·Application pending·0 cites
- 1759US8956964B2Semiconductor device and fabrication methodSEMICONDUCTOR MFG INT SHANGHAI·Filed 2013·Granted Feb 17, 2015·1 cites·19 claims
- 1859US8748248B2Semiconductor device including contact holes and method for forming the sameSEMICONDUCTOR MFG INT CORP·Filed 2013·Granted Jun 10, 2014·1 cites·15 claims
- 1958US2024369528A1Performance testing method and system for polycarboxylate superplasticizer in concrete systemUNIV QINGDAO TECHNOLOGY·Filed 2022·Application pending·0 cites
- 2057US9087845B2Electrically conductive device and manufacturing method thereofSEMICONDUCTOR MFG INT SHANGHAI·Filed 2014·Granted Jul 21, 2015·0 cites·8 claims
- 2156US2025051235A1Early-strength and quick-setting ultra-high performance concrete (uhpc), and preparation method and use thereofUNIV QINGDAO TECHNOLOGY·Filed 2022·Application pending·0 cites
- 2256US2025011235A1Dual-scale toughened cement-based composite material and use thereofUNIV QINGDAO TECHNOLOGY·Filed 2022·Application pending·0 cites
- 2354US2025118202A1Systems and methods for predicting traffic signal phase and timingFORD GLOBAL TECH LLC·Filed 2023·Application pending·0 cites
- 2454US2025358928A1Display deviceCHENGDU BOE OPTOELECT TECH CO·Filed 2024·Application pending·0 cites
- 2553US12453002B2Reinforcement board for flexible printed circuit board, flexible printed circuit board assembly, and display deviceCHENGDU BOE OPTOELECT TECH CO·Filed 2021·Granted Oct 21, 2025·0 cites·10 claims
- 2653US2025384120A1Application handoff method and terminal deviceHONOR DEVICE CO LTD·Filed 2023·Application pending·0 cites
- 2753US2024102204A1Spinning solution, heat-resistant creep-resistant fiber and preparation method thereforUNIV DONGHUA·Filed 2021·Application pending·0 cites
- 2853US2025231779A1Interface Generation Method and Electronic DeviceHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 2952US9799664B2Flash memory devicesSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2016·Granted Oct 24, 2017·0 cites·8 claims
- 3052US8932950B2Electrically conductive device and manufacturing method thereofSEMICONDUCTOR MFG INT CORP·Filed 2012·Granted Jan 13, 2015·0 cites·8 claims
- 3151US11778848B2Flexible display panel, touch display module, and display deviceCHENGDU BOE OPTOELECT TECH CO·Filed 2021·Granted Oct 3, 2023·0 cites·18 claims
- 3250US12075682B2Display deviceCHENGDU BOE OPTOELECT TECH CO·Filed 2021·Granted Aug 27, 2024·0 cites·15 claims
- 3350US2025204186A1Display panel and display deviceCHENGDU BOE OPTOELECT TECH CO·Filed 2022·Application pending·0 cites
- 3450US2013270508A1Non-Volatile Memory Device and Method of Forming the SameAGENCY SCIENCE TECH & RES·Filed 2013·Application pending·0 cites
- 3548US12035556B2Display device and method for manufacturing the sameCHENGDU BOE OPTOELECT TECH CO·Filed 2020·Granted Jul 9, 2024·0 cites·17 claims
- 3648US11447419B2Lightweight aggregate ultra-high performance concrete (UHPC) and preparation method thereofUNIV QINGDAO TECHNOLOGY·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 3748US9666688B2Semiconductor device production method and semiconductor deviceUNISANTIS ELECT SINGAPORE PTE·Filed 2016·Granted May 30, 2017·0 cites·5 claims
- 3847US9431405B2Method for forming flash memory devicesSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2015·Granted Aug 30, 2016·0 cites·15 claims
- 3946US9318445B2Semiconductor device and manufacturing method thereof for protecting metal-gate from oxidationSEMICONDUCTOR MFG INT BEIJING·Filed 2013·Granted Apr 19, 2016·0 cites·5 claims
- 4046US2024355851A1Photoelectric sensor and fabrication method thereof, and electronic deviceSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Application pending·0 cites
- 4145US9515078B2Semiconductor structure and method for forming the sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2014·Granted Dec 6, 2016·0 cites·20 claims
- 4244US9484204B2Transistor and method for forming the sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2014·Granted Nov 1, 2016·0 cites·16 claims
- 4344US9136164B2Semiconductor device and fabrication methodSEMICONDUCTOR MFG INT SHANGHAI·Filed 2014·Granted Sep 15, 2015·0 cites·20 claims
- 4442US9396993B2Device having reduced pad peeling during tensile stress testing and a method of forming thereofSEMICONDUCTOR MFG INT SHANGHAI·Filed 2014·Granted Jul 19, 2016·0 cites·20 claims
- 4542US9082838B2Method for producing a semiconductor device and semiconductor deviceUNISANTIS ELECT SINGAPORE PTE·Filed 2013·Granted Jul 14, 2015·0 cites·9 claims
- 4641US12354555B2Display device, controlling method and apparatus, display apparatus, and computer storage mediumCHENGDU BOE OPTOELECT TECH CO·Filed 2022·Granted Jul 8, 2025·0 cites·18 claims
- 4741US11874987B2Touch sensor and display apparatusCHENGDU BOE OPTOELECT TECH CO·Filed 2020·Granted Jan 16, 2024·0 cites·19 claims
- 4841US9633858B2Methods for forming semiconductor deviceSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2015·Granted Apr 25, 2017·0 cites·16 claims
- 4941US9324662B2Semiconductor device and manufacturing method thereof for protecting metal-gate from oxidationWANG XINPENG·Filed 2011·Granted Apr 26, 2016·0 cites·8 claims
- 5041US8836051B2Method for producing semiconductor device and semiconductor deviceUNISANTIS ELECT SINGAPORE PTE·Filed 2013·Granted Sep 16, 2014·0 cites·11 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →