Inventor · disambiguated record
Xiao-Long Wu
Also filed as: WU XIAO · Wu xiao-long
9 granted patents·7 pending applications·110 citations·filing 2000–2022
86Inventor score
Files withTAI SOL ELECTRONICS CO LTD6NVIDIA CORP4SZ DJI TECHNOLOGY CO LTD3APPLE INC2FORD GLOBAL TECH INC1
Top patents by PatentIndex Score
16 records- 0192USD822124SRobot vehicleSZ DJI TECHNOLOGY CO LTD·Filed 2017·Granted Jul 3, 2018·41 cites·1 claims
- 0286USD803765SRobot vehicleSZ DJI TECHNOLOGY CO LTD·Filed 2015·Granted Nov 28, 2017·29 cites·1 claims
- 0382USD780062SUnmanned aerial vehicleSZ DJI TECHNOLOGY CO LTD·Filed 2015·Granted Feb 28, 2017·29 cites·1 claims
- 0479US10503473B1Floating-point division alternative techniquesAPPLE INC·Filed 2018·Granted Dec 10, 2019·3 cites·20 claims
- 0573US10282169B2Floating-point multiply-add with down-conversionAPPLE INC·Filed 2016·Granted May 7, 2019·2 cites·20 claims
- 0653US11954487B2Techniques, devices, and instruction set architecture for efficient modular division and inversionNVIDIA CORP·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0749US12003633B2Techniques, devices, and instruction set architecture for balanced and secure ladder computationsNVIDIA CORP·Filed 2022·Granted Jun 4, 2024·0 cites·22 claims
- 0846US6439653B1Mounting structure with improved stiffness characteristicsFORD GLOBAL TECH INC·Filed 2000·Granted Aug 27, 2002·6 cites·16 claims
- 0945US11985221B2Efficient masking of secure data in ladder-type cryptographic computationsNVIDIA CORP·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1045US2019316848A1Loop heat pipe with fluid slug pipeTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1145US2019331430A1Loop heat pipe partitioned into vapor channel and liquid channelTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1244US2019331431A1Loop heat pipe with different pipe diametersTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1343US2023244445A1Techniques and devices for efficient montgomery multiplication with reduced dependenciesNVIDIA CORP·Filed 2022·Application pending·0 cites
- 1443US2019242655A1Flat heat pipe with composite wick materialTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1540US2017160018A1Heat pipe with fiber wick structureTAI-SOL ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1635US2019331432A1Loop heat pipe having condensation segment partially filled with wickTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →