Inventor · disambiguated record
Xiangshui Wu
Also filed as: Wu Xiangshui
0 granted patents·2 pending applications·0 citations·filing 2024–2025
Technology areasH10W
Files withNEXPERIA TECH SHANGHAI LTD2
Top patents by PatentIndex Score
2 records- 0152US2025118607A1Substrate for power semiconductor packaging and a package containing such substrateNEXPERIA TECH SHANGHAI LTD·Filed 2024·Application pending·0 cites
- 0240US2025247013A1Module for an electric circuit having a planarly stacked structure for power package terminals, as well as a related power module and method of manufacturing such a moduleNEXPERIA TECH SHANGHAI LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →