Inventor · disambiguated record
Xianping Zeng
Also filed as: ZENG XIANPING
16 granted patents·15 pending applications·6 citations·filing 2011–2021
85Inventor score
Top patents by PatentIndex Score
31 records- 0187US9873789B2Halogen-free epoxy resin composition, prepreg and laminate using sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Jan 23, 2018·3 cites·24 claims
- 0281US11053352B2Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·17 claims
- 0369US10544255B2Epoxy resin composition, prepreg and laminate prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Jan 28, 2020·1 cites·18 claims
- 0463US10308806B2Resin composition and uses thereof in high frequency circuit boardsSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jun 4, 2019·0 cites·20 claims
- 0561US11261305B2Thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 0660US10645806B2Polyphenyl ether resin composition and use thereof in high-frequency circuit substrateSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted May 5, 2020·1 cites·19 claims
- 0759US2023257583A1Resin composition and resin film, prepreg, laminated board, copper-clad board and printed circuit board comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 0855US2015183992A1Thermosetting resin composition and usage thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 0954US12104054B2Resin composition, prepreg containing same, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Oct 1, 2024·0 cites·10 claims
- 1053US2016255718A1An epoxy resin composition, and prepreg and copper-clad laminate made by using sameXIN YUJUN·Filed 2014·Application pending·0 cites
- 1151US10584222B2Resin composition and pre-preg and laminate using the compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Mar 10, 2020·0 cites·21 claims
- 1250US10723875B2Halogen-free epoxy resin composition and a prepreg and a laminate using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Jul 28, 2020·0 cites·20 claims
- 1349US10858514B2Resin composition and pre-preg and laminate using the compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Dec 8, 2020·0 cites·15 claims
- 1447US10208156B2Epoxy resin composition, prepreg and laminate using sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Feb 19, 2019·0 cites·22 claims
- 1546US10149380B2Resin composition and its useSHENGYI TECHNOLOGY CO LTD·Filed 2013·Granted Dec 4, 2018·0 cites·17 claims
- 1646US2015189744A1Thermosetting resin composition and usage thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1745US10745599B2Polyphenyl ether resin composition and use thereof in high-frequency circuit substrateSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Aug 18, 2020·0 cites·21 claims
- 1845US10465069B2Polyphenyl ether resin composition and prepreg, laminated board and printed circuit board containing sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Nov 5, 2019·0 cites·20 claims
- 1945US2015189745A1Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the compositionSHENGYI TECHNOLOGY CO LTD·Filed 2012·Application pending·0 cites
- 2044US11390735B2Thermosetting resin composition and prepreg and metal foil-covered laminate made using sameSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Jul 19, 2022·0 cites·5 claims
- 2143US2021070980A1Thermosetting resin composition, and prepreg and metal foil clad laminate made therefromSHENGYI TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 2243US2015240055A1Epoxy resin compound and prepreg and copper-clad laminate manufactured using the compoundZENG XIANPING·Filed 2012·Application pending·0 cites
- 2342US10029438B2Thermosetting resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jul 24, 2018·0 cites·7 claims
- 2441US2016007452A1Circuit substrate and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 2541US2022210914A1Copper clad laminate and printed-circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 2641US2014342161A1Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the SameZENG XIANPING·Filed 2011·Application pending·0 cites
- 2741US2014349120A1Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the SameZENG XIANPING·Filed 2011·Application pending·0 cites
- 2840US2020157261A1Thermosetting resin composition, and prepreg and metal foil clad laminate prepared from sameSHENGYI TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 2938US2020207976A1Epoxy resin composition and prepreg, laminated board and printed-circuit board comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 3037US2012164463A1Cyanate ester resin composition, and prepreg and laminate made therefromTANG JUNQI·Filed 2011·Application pending·0 cites
- 3132US2012164464A1Cyanate ester resin composition, and prepreg and laminate made therefromTANG JUNQI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →