Inventor · disambiguated record
Xinru Zeng
Also filed as: Zeng Xinru
8 granted patents·9 pending applications·9 citations·filing 2020–2024
78Inventor score
Files withYANGTZE MEMORY TECH CO LTD17
Top patents by PatentIndex Score
17 records- 0194US11133290B2Chip package structure with stacked chips and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·8 cites·18 claims
- 0283US11688721B2Chip package structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 0377US2025022850A1Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0477US2025096220A1Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0577US2025022851A1Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0676US12205940B2Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·19 claims
- 0775US12125827B2Chip package structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0870US12334361B2Substrate structure, and fabrication and packaging methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0966US12166012B2Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·14 claims
- 1066US11721686B2Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·16 claims
- 1160US11694904B2Substrate structure, and fabrication and packaging methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1257US2025233060A1Semiconductor package structure with glass substrate and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1355US2024290727A1Chip package structure and manufacturing methods for the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1455US2024312925A1Semiconductor device, fabricating method, memory device and device systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1554US2024332152A1Integrated package device, fabrication method thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1654US2024355651A1Workpiece tape removingYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1754US2024332269A1Semiconductor package structure, fabrication method and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →