Inventor · disambiguated record
Xiaoqi Zhu
Also filed as: ZHU XIAOQI
7 granted patents·3 pending applications·1,397 citations·filing 1998–2023
92Inventor score
Top patents by PatentIndex Score
10 records- 0197US6518677B1Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2000·Granted Feb 11, 2003·150 cites·57 claims
- 0297US6335571B1Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2000·Granted Jan 1, 2002·399 cites·10 claims
- 0397US6297560B1Semiconductor flip-chip assembly with pre-applied encapsulating layersCAPOTE MIGUEL ALBERT·Filed 1998·Granted Oct 2, 2001·276 cites·35 claims
- 0496US6121689ASemiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 1998·Granted Sep 19, 2000·246 cites·43 claims
- 0595US6399426B1Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2001·Granted Jun 4, 2002·172 cites·4 claims
- 0694US6774493B2Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2003·Granted Aug 10, 2004·78 cites·25 claims
- 0792US6566234B1Semiconductor flip-chip package and method for the fabrication thereofAGUILA TECHNOLOGIES INC·Filed 2000·Granted May 20, 2003·76 cites·58 claims
- 0864US2025372948A1Photonic Crystal Laser and Preparation Method ThereforSHENZHEN PHOTONX TECH CO LTD·Filed 2023·Application pending·0 cites
- 0942US2005218517A1Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2004·Application pending·0 cites
- 1038US2002014703A1Semiconductor flip-chip package and method for the fabrication thereofFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →