Inventor · disambiguated record
Xuanxuan Chen
Also filed as: CHEN XUANXUAN
7 granted patents·4 pending applications·0 citations·filing 2016–2025
68Inventor score
Files withINTEL CORP6TOKYO OHKA KOGYO CO LTD3FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD1SHENZHEN YINWANG INTELLIGENT TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
11 records- 0167US12012473B2Directed self-assembly structures and techniquesINTEL CORP·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 0266US12266527B1Directed self-assembly enabled patterning over metal layers using assisting featuresINTEL CORP·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 0364US2025174458A1Directed self-assembly enabled patterning over metal layers using assisting featuresINTEL CORP·Filed 2025·Application pending·0 cites
- 0457US12513888B2Memory device and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·18 claims
- 0556US9914847B2Resin composition for forming a phase-separated structure, and method of producing structure containing phase-separated structureTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Mar 13, 2018·0 cites·7 claims
- 0655US12293913B1Directed self-assembly enabled subtractive metal patterningINTEL CORP·Filed 2021·Granted May 6, 2025·0 cites·20 claims
- 0755US2025129655A1Power Supply Apparatus, Vehicle Door Assembly, Vehicle, and Electronic DeviceSHENZHEN YINWANG INTELLIGENT TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 0848US10179866B2Resin composition for forming a phase-separated structure, and method of producing structure containing phase-separated structureTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Jan 15, 2019·0 cites·2 claims
- 0948US2022199462A1Via opening rectification using lamellar triblock copolymer, polymer nanocomposite, or mixed epitaxyINTEL CORP·Filed 2021·Application pending·0 cites
- 1045US2022199540A1Guided vias in microelectronic structuresINTEL CORP·Filed 2020·Application pending·0 cites
- 1144US9828519B2Resin composition for forming a phase-separated structure, and method of producing structure containing phase-separated structureTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →