Inventor · disambiguated record
Xueping Guo
Also filed as: GUO XUEPING
8 granted patents·8 pending applications·2 citations·filing 2006–2022
73Inventor score
Files withBLOOMAGE BIOTECHNOLOGY CORP LTD4HONOR DEVICE CO LTD4HUAWEI TECH CO LTD2BLOOMAGE BIOTECH TIANJIN CO LTD1BLOOMAGE FREDA BIOPHARM CO LTD1
Top patents by PatentIndex Score
16 records- 0159US9997493B2Flexible-substrate-based three-dimensional packaging structure and methodINST OF MICROELECTRONICS CAS·Filed 2014·Granted Jun 12, 2018·1 cites·6 claims
- 0255US9493755B2Bacillus, hyaluronidase, and uses thereofBLOOMAGE FREDA BIOPHARM CO LTD·Filed 2012·Granted Nov 15, 2016·1 cites·23 claims
- 0352US12317464B2Package body, preparation method thereof, terminal, and electronic deviceHONOR DEVICE CO LTD·Filed 2021·Granted May 27, 2025·0 cites·15 claims
- 0450US2024009107A1Hyaluronic acid composition having permeation-promoting effect, preparation method therefor and use thereofBLOOMAGE BIOTECH TIANJIN CO LTD·Filed 2021·Application pending·0 cites
- 0548US11932881B2Heparin skeleton synthase and its mutants and applicationSHAN DONG UNIV·Filed 2022·Granted Mar 19, 2024·0 cites·7 claims
- 0648US2023407238A1Use of hyaluronic acid or salt thereof and/or trehalose in stabilizing ergothioneine, and ergothioneine composition containing hyaluronic acid or salt thereof and/or trehaloseBLOOMAGE BIOTECHNOLOGY CORP LTD·Filed 2021·Application pending·0 cites
- 0748US2024234334A9Electronic Device and Chip Packaging MethodHONOR DEVICE CO LTD·Filed 2022·Application pending·0 cites
- 0847US2024250016A1Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic DeviceHONOR DEVICE CO LTD·Filed 2022·Application pending·0 cites
- 0946US2024165015A1Lactobacillus rhamnosus, ferment lysate for regulating skin microecology, preparation method, and applicationBLOOMAGE BIOTECHNOLOGY CORP LTD·Filed 2022·Application pending·0 cites
- 1044US2024150742A1Gene for efficiently expressing hyaluronic acid hydrolase and expression method thereofBLOOMAGE BIOTECHNOLOGY CORP LTD·Filed 2021·Application pending·0 cites
- 1143US12170868B2Wireless headsetHUAWEI TECH CO LTD·Filed 2020·Granted Dec 17, 2024·0 cites·20 claims
- 1242US9583418B2Chip embedded package method and structureNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2014·Granted Feb 28, 2017·0 cites·7 claims
- 1342US8093374B2Bismuth hyaluronate, the preparation method and the use thereofLING PEIXUE·Filed 2006·Granted Jan 10, 2012·0 cites·7 claims
- 1441US12501797B2Foldable display apparatus, manufacturing method therefor, and terminal deviceHONOR DEVICE CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 1538US2022254695A1Embedded package structure and preparation method therefor, and terminalHUAWEI TECH CO LTD·Filed 2020·Application pending·0 cites
- 1636US2022056494A1Strain producing ergothioneine and method for screening the sameBLOOMAGE BIOTECHNOLOGY CORP LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →