Inventor · disambiguated record
Xu Yi
Also filed as: YI XU · YI XU DONG
22 granted patents·322 citations·filing 2000–2019
95Inventor score
Files withCHARTERED SEMICONDUCTOR MFG12HEPTAGON MICRO OPTICS PTE LTD6AMS SENSORS SINGAPORE PTE LTD1BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO LTD1HUNAN TANKANG BIOTECH CO LTD1
Top patents by PatentIndex Score
22 records- 0194US6424044B1Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallizationCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Jul 23, 2002·99 cites·13 claims
- 0291US6232217B1Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via openingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 15, 2001·81 cites·34 claims
- 0387US6261942B1Dual metal-oxide layer as air bridgeCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 17, 2001·42 cites·51 claims
- 0485US9094593B2Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modulesHEPTAGON MICRO OPTICS PTE LTD·Filed 2014·Granted Jul 28, 2015·7 cites·18 claims
- 0583US9543354B2Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modulesHEPTAGON MICRO OPTICS PTE LTD·Filed 2014·Granted Jan 10, 2017·3 cites·29 claims
- 0682US10243111B2Optoelectronic device subassemblies and methods of manufacturing the sameHEPTAGON MICRO OPTICS PTE LTD·Filed 2017·Granted Mar 26, 2019·4 cites·20 claims
- 0778US6540841B1Method and apparatus for removing contaminants from the perimeter of a semiconductor substrateCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 1, 2003·13 cites·12 claims
- 0875US11597082B2Dispatching method and device, and non-transitory readable storage mediumBEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO LTD·Filed 2017·Granted Mar 7, 2023·1 cites·20 claims
- 0974US6340608B1Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper padsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 22, 2002·21 cites·11 claims
- 1073US10186540B2Optoelectronic modules that have shielding to reduce light leakage or stray lightHEPTAGON MICRO OPTICS PTE LTD·Filed 2015·Granted Jan 22, 2019·2 cites·9 claims
- 1169US6429129B1Method of using silicon rich carbide as a barrier material for fluorinated materialsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·11 cites·21 claims
- 1267US10199426B2Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modulesHEPTAGON MICRO OPTICS PTE LTD·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 1365US9859327B2Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modulesHEPTAGON MICRO OPTICS PTE LTD·Filed 2016·Granted Jan 2, 2018·0 cites·26 claims
- 1464US6375857B1Method to form fuse using polymeric filmsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 23, 2002·12 cites·13 claims
- 1563US6813796B2Apparatus and methods to clean copper contamination on wafer edgeCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Nov 9, 2004·4 cites·5 claims
- 1663US6365508B1Process without post-etch cleaning-converting polymer and by-products into an inert layerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 2, 2002·11 cites·20 claims
- 1760US6730591B2Method of using silicon rich carbide as a barrier material for fluorinated materialsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted May 4, 2004·6 cites·27 claims
- 1856US6358821B1Method of copper transport prevention by a sputtered gettering layer on backside of waferCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 19, 2002·5 cites·41 claims
- 1955US10510932B2Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the sameAMS SENSORS SINGAPORE PTE LTD·Filed 2019·Granted Dec 17, 2019·0 cites·15 claims
- 2044US7060613B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Jun 13, 2006·0 cites·4 claims
- 2143US10269645B2Fin field-effect transistor and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 2229US11980548B2Carbon fiber composite artificial bone and preparation method thereofHUNAN TANKANG BIOTECH CO LTD·Filed 2018·Granted May 14, 2024·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →