Inventor · disambiguated record
Xuejun Ying
Also filed as: YING XUEJUN
13 granted patents·3 pending applications·83 citations·filing 2002–2024
90Inventor score
Files withMAXIM INTEGRATED PRODUCTS6NINGBO JIELIPU HOUSEWARE CO LTD3INTEL CORP2SAMOILOV ARKADII V1SRIDHAR UPPILI1
Top patents by PatentIndex Score
16 records- 0192US8487405B2Deep trench capacitor with conformally-deposited conductive layers having compressive stressTIAN LEI·Filed 2011·Granted Jul 16, 2013·23 cites·16 claims
- 0287US9196587B2Semiconductor device having a die and through substrate-viaMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Nov 24, 2015·8 cites·12 claims
- 0387US8963287B1Deep trench capacitor with conformally-deposited conductive layers having compressive stressMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 24, 2015·8 cites·16 claims
- 0484USD985999SLidNINGBO JIELIPU HOUSEWARE CO LTD·Filed 2021·Granted May 16, 2023·11 cites·1 claims
- 0581US8742574B2Semiconductor device having a through-substrate viaSAMOILOV ARKADII V·Filed 2011·Granted Jun 3, 2014·6 cites·10 claims
- 0679US9105750B1Semiconductor device having a through-substrate viaMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Aug 11, 2015·4 cites·13 claims
- 0777US7027677B2Integrating optical components on a planar light circuitINTEL CORP·Filed 2004·Granted Apr 11, 2006·20 cites·21 claims
- 0876US9659900B2Semiconductor device having a die and through-substrate viaMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted May 23, 2017·2 cites·27 claims
- 0972US9331048B2Bonded stacked wafers and methods of electroplating bonded stacked wafersMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted May 3, 2016·1 cites·20 claims
- 1058US8970043B2Bonded stacked wafers and methods of electroplating bonded stacked wafersZOU QUANBO·Filed 2011·Granted Mar 3, 2015·0 cites·16 claims
- 1146US9040386B2Method for varied topographic MEMS cap processMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted May 26, 2015·0 cites·18 claims
- 1242US2005175306A1Waveguides with integrated lenses and reflective surfacesINTEL CORP·Filed 2005·Application pending·0 cites
- 1337USD1097679SMicrowave cooking utensilNINGBO JIELIPU HOUSEWARE CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·1 claims
- 1437US2012194306A1Preventing contact stiction in micro relaysSRIDHAR UPPILI·Filed 2011·Application pending·0 cites
- 1534USD1101470SMicrowave cooking utensil setNINGBO JIELIPU HOUSEWARE CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·1 claims
- 1634US2004120672A1Waveguides with integrated lenses and reflective surfacesFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →