Inventor · disambiguated record
Yasuyuki Akai
Also filed as: AKAI YASUYUKI
14 granted patents·7 pending applications·10 citations·filing 2012–2022
84Inventor score
Top patents by PatentIndex Score
21 records- 0188US9902675B2Vinyl-group-containing fluorene compoundTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Feb 27, 2018·6 cites·2 claims
- 0276US9206138B2Crystal containing unsaturated carboxylic acid amide compound and method for producing sameDAICEL CORP·Filed 2013·Granted Dec 8, 2015·3 cites·4 claims
- 0371US12073957B2Conductor materialUNIV TOKYO·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 0460US10418559B2Solvent or solvent composition for organic transistor productionDAICEL CORP·Filed 2013·Granted Sep 17, 2019·1 cites·8 claims
- 0556US12046390B2Dopant, electroconductive composition and method for producing sameUNIV TOKYO·Filed 2020·Granted Jul 23, 2024·0 cites·8 claims
- 0656US10693080B2Solvent for producing organic transistorDAICEL CORP·Filed 2014·Granted Jun 23, 2020·0 cites·4 claims
- 0756US2018050973A1Vinyl-group-containing fluorene compoundTOKYO OHKA KOGYO CO LTD·Filed 2017·Application pending·0 cites
- 0853US12152169B2Adhesive conductive pasteDAICEL CORP·Filed 2020·Granted Nov 26, 2024·0 cites·8 claims
- 0951US12358926B2Compound and application thereofDAICEL CORP·Filed 2020·Granted Jul 15, 2025·0 cites·18 claims
- 1050US12049540B2Dopant and conductor materialUNIV TOKYO·Filed 2021·Granted Jul 30, 2024·0 cites·16 claims
- 1149US2016170302A1Novel compoundTOKYO OHKA KOGYO CO LTD·Filed 2016·Application pending·0 cites
- 1249US2024147741A1Inorganic/organic hybrid complementary semiconductor device and method for manufacturing sameUNIV TOKYO·Filed 2022·Application pending·0 cites
- 1348US11655381B2Solvent composition for electronic device productionDAICEL CORP·Filed 2018·Granted May 23, 2023·0 cites·18 claims
- 1448US10336708B2Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Jul 2, 2019·0 cites·15 claims
- 1547US2024128144A1Sealing material for compounds having non-stoichiometric composition and method for manufacturing sameUNIV TOKYO·Filed 2022·Application pending·0 cites
- 1645US11702557B2Ink composition for manufacturing organic semiconductor deviceDAICEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·7 claims
- 1742US10892424B2Composition for manufacturing organic semiconductor deviceDAICEL CORP·Filed 2017·Granted Jan 12, 2021·0 cites·6 claims
- 1842US2014221649A1Novel compoundSHIOTA DAI·Filed 2012·Application pending·0 cites
- 1937US2019006603A1Composition for manufacturing organic semiconductor deviceDAICEL CORP·Filed 2016·Application pending·0 cites
- 2035US2015333269A1Solvent or solvent composition for manufacturing organic transistorDAICEL CORP·Filed 2013·Application pending·0 cites
- 2134US10373729B2Composition for forming coat-type insulating filmDAICEL CORP·Filed 2015·Granted Aug 6, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →