Inventor · disambiguated record
Yakub Aliyu
Also filed as: ALIYU YAKUB
28 granted patents·5 pending applications·438 citations·filing 1998–2011
97Inventor score
Top patents by PatentIndex Score
33 records- 0194US6683002B1Method to create a copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 27, 2004·71 cites·7 claims
- 0286US6417088B1Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·44 cites·22 claims
- 0386US6378759B1Method of application of conductive cap-layer in flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·37 cites·17 claims
- 0484US6720204B2Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Apr 13, 2004·38 cites·18 claims
- 0580US6475810B1Method of manufacturing embedded organic stop layer for dual damascene patterningCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Nov 5, 2002·24 cites·24 claims
- 0678US6540841B1Method and apparatus for removing contaminants from the perimeter of a semiconductor substrateCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 1, 2003·13 cites·12 claims
- 0778US6429117B1Method to create copper traps by modifying treatment on the dielectrics surfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·21 cites·34 claims
- 0874US6340608B1Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper padsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 22, 2002·21 cites·11 claims
- 0972US6350689B1Method to remove copper contamination by using downstream oxygen and chelating agent plasmaCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 26, 2002·15 cites·40 claims
- 1065US6705512B2Method of application of conductive cap-layer in flip-chip, cob, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 16, 2004·10 cites·17 claims
- 1163US6813796B2Apparatus and methods to clean copper contamination on wafer edgeCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Nov 9, 2004·4 cites·5 claims
- 1263US6365508B1Process without post-etch cleaning-converting polymer and by-products into an inert layerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 2, 2002·11 cites·20 claims
- 1363US6211032B1Method for forming silicon carbide chrome thin-film resistorNAT SEMICONDUCTOR CORP·Filed 1998·Granted Apr 3, 2001·33 cites·26 claims
- 1462US6987321B2Copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Jan 17, 2006·7 cites·20 claims
- 1561US6261955B1Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processesCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 17, 2001·6 cites·16 claims
- 1661US6081014ASilicon carbide chrome thin-film resistorNAT SEMICONDUCTOR CORP·Filed 1998·Granted Jun 27, 2000·30 cites·32 claims
- 1760US6415973B1Method of application of copper solution in flip-chip, COB, and micrometal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·9 cites·25 claims
- 1859US6391783B1Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly techniqueCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 21, 2002·6 cites·22 claims
- 1959US6309982B1Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agentCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Oct 30, 2001·6 cites·19 claims
- 2056US6967162B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Nov 22, 2005·4 cites·7 claims
- 2156US6692579B2Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequenceCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 17, 2004·5 cites·7 claims
- 2256US6358821B1Method of copper transport prevention by a sputtered gettering layer on backside of waferCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 19, 2002·5 cites·41 claims
- 2351US6277691B1Method to fabricate a robust and reliable memory deviceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 21, 2001·8 cites·20 claims
- 2450US6821888B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Nov 23, 2004·2 cites·16 claims
- 2548US6803305B2Method for forming a via in a damascene processCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Oct 12, 2004·4 cites·21 claims
- 2646US6686279B2Method for reducing gouging during via formationCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Feb 3, 2004·4 cites·14 claims
- 2744US7452808B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Nov 18, 2008·0 cites·6 claims
- 2844US7060613B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Jun 13, 2006·0 cites·4 claims
- 2944US2012279865A1Touch Fingerprint Sensor Using 1-3 Piezo Composites and Acoustic Impediography PrincipleREGNIERE LOUIS·Filed 2011·Application pending·0 cites
- 3043US2005090037A1Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3140US2002048950A1Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processesCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 3239US2011269307A1Method for Making Integrated Circuit Device Using Copper Metallization on 1-3 PZT CompositeSONAVATION INC·Filed 2011·Application pending·0 cites
- 3336US2004077174A1Method for forming a high aspect ratio viaCHARTERED SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →