Inventor · disambiguated record
Yasutomi Asai
Also filed as: ASAI YASUTOMI
12 granted patents·2 pending applications·247 citations·filing 1996–2015
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0189US6376906B1Mounting structure of semiconductor elementDENSO CORP·Filed 1998·Granted Apr 23, 2002·122 cites·42 claims
- 0287US8446003B2Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrateKOMURA ATSUSHI·Filed 2010·Granted May 21, 2013·14 cites·19 claims
- 0386US8207607B2Semiconductor device with resin moldYAMAGISHI TETSUTO·Filed 2008·Granted Jun 26, 2012·16 cites·16 claims
- 0475US5731067AMulti-layered substrateDENSO CORP·Filed 1996·Granted Mar 24, 1998·49 cites·26 claims
- 0567US8749055B2Semiconductor device with resin moldYAMAGISHI TETSUTO·Filed 2012·Granted Jun 10, 2014·2 cites·9 claims
- 0666US8309434B2Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereonASAI YASUTOMI·Filed 2010·Granted Nov 13, 2012·3 cites·2 claims
- 0754US9087924B2Semiconductor device with resin moldDENSO CORP·Filed 2014·Granted Jul 21, 2015·0 cites·7 claims
- 0850US6645606B2Electrical device having metal pad bonded with metal wiring and manufacturing method thereofDENSO CORP·Filed 2002·Granted Nov 11, 2003·4 cites·8 claims
- 0950US6217990B1Multilayer circuit board having no local warp on mounting surface thereofDENSO CORP·Filed 1998·Granted Apr 17, 2001·19 cites·13 claims
- 1048US2007278550A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2007·Application pending·0 cites
- 1147US6326239B1Mounting structure of electronic parts and mounting method of electronic partsDENSO CORP·Filed 1999·Granted Dec 4, 2001·14 cites·12 claims
- 1242US2007075419A1Semiconductor device having metallic lead and electronic device having lead frameDENSO CORP·Filed 2006·Application pending·0 cites
- 1334US10002841B2Semiconductor deviceDENSO CORP·Filed 2015·Granted Jun 19, 2018·0 cites·5 claims
- 1430US6048424AMethod for manufacturing ceramic laminated substrateDENSO CORP·Filed 1998·Granted Apr 11, 2000·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →