Inventor · disambiguated record
Yann Beilliard
Also filed as: BEILLIARD YANN
3 granted patents·4 citations·filing 2014–2015
55Inventor score
Top patents by PatentIndex Score
3 records- 0173US9449896B2Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication methodST MICROELECTRONICS SA·Filed 2015·Granted Sep 20, 2016·3 cites·28 claims
- 0260US11305372B2Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materialsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Apr 19, 2022·1 cites·17 claims
- 0342US9165861B2Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structureST MICROELECTRONICS SA·Filed 2014·Granted Oct 20, 2015·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Yann Beilliard files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →