Inventor · disambiguated record

Ya Hui Chang

Also filed as: CHANG YA-HUI

60 granted patents·26 pending applications·147 citations·filing 2001–2025

98Inventor score

Technology areasH10P H10W G03F G06F C11D

Files withTAIWAN SEMICONDUCTOR MFG CO LTD56 TAIWAN SEMICONDUCTOR MFG8 CHANG YA-HUI5 PEGAVISION CORP2 LI CHUN-MING1

Top patents by PatentIndex Score

86 records

0193US12265332B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 1, 2025·2 cites·20 claims
0293US11791161B2Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 17, 2023·2 cites·20 claims
0393US10658184B2Pattern fidelity enhancement with directional patterning technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 19, 2020·7 cites·12 claims
0492US10861698B2Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 8, 2020·5 cites·19 claims
0590US11322362B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·4 cites·20 claims
0690US9786569B1Overlay measurement and compensation in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·12 cites·20 claims
0789US11776810B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
0889US11289332B2Directional processing to remove a layer or a material formed over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·4 cites·20 claims
0989US10354874B2Directional processing to remove a layer or a material formed over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·4 cites·20 claims
1088US10761427B2Photoresist and method of formation and useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 1, 2020·3 cites·21 claims
1188US9341945B2Photoresist and method of formation and useTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·5 cites·20 claims
1287US2025308892A1Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1386US8865595B2Device and methods for forming partially self-aligned trenchesCHANG YA HUI·Filed 2012·Granted Oct 21, 2014·8 cites·20 claims
1486US8564068B2Device and methods for small trench patterningCHANG YA HUI·Filed 2012·Granted Oct 22, 2013·5 cites·20 claims
1585US12334342B2Pattern fidelity enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
1685US12287575B2Photoresist and method of formation and useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
1785US9823574B2Lithography alignment marksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 21, 2017·4 cites·20 claims
1885US6458705B1Method for forming via-first dual damascene interconnect structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Oct 1, 2002·44 cites·20 claims
1984US2025224673A1Photoresist and method of formation and useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2083US10707081B2Fine line patterning methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 7, 2020·2 cites·18 claims
2183US2025299953A1Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2283US2024371653A1Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2383US2025343071A1Via-first self-aligned interconnect formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2482US12125712B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
2582US8716804B2Device and methods for small trench patterningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 6, 2014·3 cites·20 claims
2681US12347681B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
2781US8563410B2End-cut first approach for critical dimension controlLIN LI-TE S·Filed 2009·Granted Oct 22, 2013·9 cites·18 claims
2880US12153350B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
2980US2025044708A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3079US11955338B2Directional deposition for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
3179US9703918B2Two-dimensional process window improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·2 cites·20 claims
3278US8592137B2Methods for small trench patterning using chemical amplified photoresist compositionsCHANG YA HUI·Filed 2011·Granted Nov 26, 2013·3 cites·20 claims
3378US2025364333A1Critical dimension uniformity (cdu) control methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3477US11798812B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
3577US2025343075A1Self-aligned cut-metal layer method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3677US2024393690A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3776US11796922B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 24, 2023·1 cites·10 claims
3876US9093276B2Methods for small trench patterning using chemical amplified photoresist compositionsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·2 cites·20 claims
3975US11862465B2Fine line patterning methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
4075US2024387149A1Etch apparatus for compensating shifted overlayersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4174US11650500B2Photoresist and method of formation and useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·0 cites·20 claims
4274US11569090B2Directional deposition for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
4374US8730473B2Multiple edge enabled patterningSHIEH MING-FENG·Filed 2010·Granted May 20, 2014·2 cites·20 claims
4474US2024145297A1Via-first self-aligned interconnect formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4574US2025199408A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4673US7948467B2Gate driver structure of TFT-LCD displayNOVATEK MICROELECTRONICS CORP·Filed 2007·Granted May 24, 2011·3 cites·13 claims
4772US12482654B2System and method for multiple step directional patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
4872US7838173B2Structure design and fabrication on photomask for contact hole manufacturing process window enhancementTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 23, 2010·3 cites·22 claims
4971US9805154B2Method of lithography process with inserting scattering barsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 31, 2017·2 cites·20 claims
5071US9111864B2Device and methods for small trench patterningTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·1 cites·20 claims

Showing the top 50 of 86 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Ya Hui Chang files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →