Inventor · disambiguated record
Yao Jung Chang
Also filed as: CHANG YAO JUNG
2 granted patents·5 pending applications·2 citations·filing 2017–2023
35Inventor score
Files withNXP BV7
Top patents by PatentIndex Score
7 records- 0173US10607861B2Die separation using adhesive-layer laser scribingNXP BV·Filed 2017·Granted Mar 31, 2020·2 cites·13 claims
- 0254US2025157862A1Semiconductor device having integrated lid structure and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0354US2025157986A1Die in die semiconductor device and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0453US2025096077A1Semiconductor device with enhanced solderability and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0552US12388030B2Semiconductor device with stress relief feature and method thereforNXP BV·Filed 2022·Granted Aug 12, 2025·0 cites·14 claims
- 0646US2025006598A1Semiconductor device with leadframe spacer and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0741US2022399234A1Semiconductor die singulationNXP BV·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →