Inventor · disambiguated record
Yao-Chung Chang
Also filed as: CHANG YAO-CHUNG
28 granted patents·8 pending applications·18 citations·filing 2001–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22NOVATEK MICROELECTRONICS CORP4GLOBAL WAFERS CO LTD2INST INFORMATION IND2UBIQUITI INC2
Top patents by PatentIndex Score
36 records- 0191US10269949B2Semiconductor structure, HEMT structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 0290US9812562B1Semiconductor structure, HEMT structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·20 claims
- 0389US11784900B2Using wireless packets to indicate device boot statusUBIQUITI INC·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 0483US12507456B2Electrode structure for vertical group III-V deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0583US12107156B2Semiconductor structure, HEMT structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0682US9941398B2High-electron-mobility transistor (HEMT) capable of protecting a III-V compound layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·3 cites·9 claims
- 0780US2025308419A1Display device for examining the status of a source line and integrated circuit thereofNOVATEK MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0880US2025308418A1Display device for examining the status of a gate line and integrated circuit thereofNOVATEK MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0977US12476891B2Using wireless packets to indicate device boot statusUBIQUITI INC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1077US12326988B2Knob on touch panel and related control methodNOVATEK MICROELECTRONICS CORP·Filed 2024·Granted Jun 10, 2025·0 cites·31 claims
- 1176US11908905B2Electrode structure for vertical group III-V deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 1276US11532740B2Semiconductor structure, HEMT structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 1375US10119210B1Textile machine adjustment method and system thereofINST INFORMATION IND·Filed 2017·Granted Nov 6, 2018·2 cites·14 claims
- 1471US2024371951A1Ohmic electrode for two-dimensional carrier gas (2dcg) semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1570US10896698B2Main board and computer apparatus with connectors of both dual in-line package and surface mount technologyWISTRON CORP·Filed 2018·Granted Jan 19, 2021·2 cites·20 claims
- 1670US2024379836A1Gallium Nitride-Based Device with Step-Wise Field Plate and Method Making the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1770US2025336863A13d ic comprising semiconductor substrates with different bandgapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1869US12046554B2Device layout design for improving device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1969US11450749B2Electrode structure for vertical group III-V deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2066US10964804B2Semiconductor structure, HEMT structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 2165US11222968B2HEMT device structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·0 cites·20 claims
- 2265US10937900B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 2, 2021·1 cites·20 claims
- 2364US11906355B1In-cell optical sensing display panelNOVATEK MICROELECTRONICS CORP·Filed 2023·Granted Feb 20, 2024·0 cites·12 claims
- 2463US12388039B23D IC comprising semiconductor substrates with different bandgapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 2561US10522671B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 2659US12132088B2Ohmic electrode for two-dimensional carrier gas (2DCG) semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 2759US11073746B2Image-capturing assemblyLUXVISIONS INNOVATION LTD·Filed 2019·Granted Jul 27, 2021·0 cites·4 claims
- 2857US12501644B2Gallium nitride-based device with step-wise field plate and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 2957US10269948B2High-electron-mobility transistor (HEMT) structure capable of protecting a III-V compound layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·0 cites·31 claims
- 3055US10062776B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·20 claims
- 3151US2010251575A1Lightweight Shoe with Decoration Structure and Manufacturing Method ThereofCHANG YAO-CHUNG·Filed 2008·Application pending·0 cites
- 3250US9397168B2Method to define the active region of a transistor employing a group III-V semiconductor materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 19, 2016·0 cites·20 claims
- 3339US9633843B2Silicon substrates with compressive stress and methods for production of the sameGLOBAL WAFERS CO LTD·Filed 2016·Granted Apr 25, 2017·0 cites·19 claims
- 3439US9378946B2Silicon substrates with compressive stress and methods for production of the sameGLOBAL WAFERS CO LTD·Filed 2015·Granted Jun 28, 2016·0 cites·19 claims
- 3537US2019155249A1Textile beam management system and textile beam management methodINST INFORMATION IND·Filed 2017·Application pending·0 cites
- 3630US2002056699A1Method for eliminating surface roughness in metal linesHANNSTAR DISPLAY CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →