Inventor · disambiguated record
Yan Chen
Also filed as: CHEN YAN · CHEN YAN-WEI
8 granted patents·10 pending applications·370 citations·filing 1996–2024
89Inventor score
Files withTONG HSING ELECTRONIC INDUSTRIES LTD8ALLIED SIGNAL INC5ATAYALAN INC1CHUNJIAN WANG1LEE CHIEN-WEI1
Top patents by PatentIndex Score
18 records- 0195US6365684B1Method of manufacturing fluoropolymersALLIED SIGNAL INC·Filed 2000·Granted Apr 2, 2002·71 cites·3 claims
- 0294US5955556AMethod of manufacturing fluoropolymersALLIED SIGNAL INC·Filed 1996·Granted Sep 21, 1999·93 cites·19 claims
- 0393US6255384B1Method of manufacturing fluoropolymersALLIED SIGNAL INC·Filed 1998·Granted Jul 3, 2001·86 cites·13 claims
- 0492US5880204ARoom temperature coalescable aqueous fluoropolymer dispersions and method for their manufactureALLIED SIGNAL INC·Filed 1996·Granted Mar 9, 1999·84 cites·23 claims
- 0587US9876003B2Electrostatic discharge protection circuit and configuration methodSEMICONDUCTOR MFG INTERNATIONAL (SHANGHAI) CORPORATION·Filed 2015·Granted Jan 23, 2018·6 cites·18 claims
- 0675US6140408ARoom temperature coalescable aqueous fluoropolymer dispersions and method for their manufactureALLIED SIGNAL INC·Filed 1998·Granted Oct 31, 2000·30 cites·21 claims
- 0762US2025001730A1Pre-mold direct bond copper (dbc) substrate and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0858US2025309087A1Power chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0958US2025293201A1Power chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1058US2025079267A1Chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1157US2025336878A1Power chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1255US2023045202A1Biological data sensorNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2022·Application pending·0 cites
- 1354US2024304575A1Bonding structure for connecting a chip and a metal material and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1454US2025253197A1Chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1552US2023396557A1Universal gateway for policy-aware traffic forwarding for multiple types of network trafficATAYALAN INC·Filed 2023·Application pending·0 cites
- 1651US12482737B2Intelligent power module package structure and hybrid ceramic boardTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Nov 25, 2025·0 cites·12 claims
- 1740US2012075209A1Touch panelLEE CHIEN-WEI·Filed 2011·Application pending·0 cites
- 1833US8766627B2Angle position sensorCHUNJIAN WANG·Filed 2009·Granted Jul 1, 2014·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →