Inventor · disambiguated record
Yan Chen
Also filed as: CHEN YAN · Chen yan-ning
11 granted patents·14 citations·filing 2016–2020
84Inventor score
Top patents by PatentIndex Score
11 records- 0191US10985645B2Alternatingly-switched parallel circuit, integrated power module and integrated power packageDELTA ELECTRONICS SHANGHAI CO·Filed 2020·Granted Apr 20, 2021·3 cites·17 claims
- 0285US11227856B2Multi-chip package power moduleDELTA ELECTRONICS SHANGHAI CO·Filed 2020·Granted Jan 18, 2022·2 cites·19 claims
- 0381US10198020B2Interleaved parallel circuit, integrated power module and integrated power chipDELTA ELECTRONICS SHANGHAI CO·Filed 2017·Granted Feb 5, 2019·4 cites·13 claims
- 0471US10871811B2Power chipDELTA ELECTRONICS SHANGHAI CO·Filed 2018·Granted Dec 22, 2020·1 cites·17 claims
- 0569US10126795B2Power chipDELTA ELECTRONICS SHANGHAI CO·Filed 2017·Granted Nov 13, 2018·1 cites·19 claims
- 0666US10826483B2Power chip and bridge circuitDELTA ELECTRONICS SHANGHAI CO·Filed 2017·Granted Nov 3, 2020·1 cites·20 claims
- 0765US10620654B2Alternatingly-switched parallel circuit, integrated power module and integrated power packageDELTA ELECTRONICS SHANGHAI CO·Filed 2018·Granted Apr 14, 2020·1 cites·20 claims
- 0859US11024588B2Power integrated moduleDELTA ELECTRONICS SHANGHAI CO·Filed 2020·Granted Jun 1, 2021·0 cites·15 claims
- 0955US10064315B2High heat-dissipation circuit board assembly system and power supply including the sameLITE ON ELECTRONICS GUANGZHOU·Filed 2016·Granted Aug 28, 2018·1 cites·18 claims
- 1051US11399438B2Power module, chip-embedded package module and manufacturing method of chip-embedded package moduleDELTA ELECTRONICS SHANGHAI CO·Filed 2019·Granted Jul 26, 2022·0 cites·22 claims
- 1150US10629550B2Power integrated moduleDELTA ELECTRONICS SHANGHAI CO·Filed 2017·Granted Apr 21, 2020·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →