Inventor · disambiguated record
Yang-Che Chen
Also filed as: CHEN YANG-CHE
27 granted patents·17 pending applications·43 citations·filing 2013–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD44
Top patents by PatentIndex Score
44 records- 0195US10276548B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 0294US11769698B2Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0394US10937858B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0492US11804433B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
- 0592US11626343B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 11, 2023·6 cites·20 claims
- 0692US10510734B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 0790US11088037B2Semiconductor device having probe pads and seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·6 cites·20 claims
- 0888US10867976B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 0985US11721597B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·20 claims
- 1081US12243788B2Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1181US10347548B2Integrated circuit package structure and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·3 cites·20 claims
- 1280US2025087553A1Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1379US2025357320A1Delamination detection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1478US2024312851A1Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1578US2025359082A1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1677US11993512B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1775US12183655B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 1875US12027433B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1974US11908884B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·13 claims
- 2073US11274037B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 2173US2023387182A1Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2273US2025174499A1Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2372US2025140684A1Delamination detection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2471US2024047310A1Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2570US11776919B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 2669US11482461B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 2768US12426283B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 2868US11322576B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2968US9254999B2Mechanisms for forming micro-electro mechanical deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 9, 2016·1 cites·20 claims
- 3066US11854913B2Method for detecting defects in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3161US11450626B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 3260US10629673B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 3360US2025233026A1Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3460US2025239495A1Semiconductor die and wafer bonding crack detector structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3557US10699977B2Method of detecting delamination in an integrated circuit package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 3655US2025015034A1Semiconductor structure with daisy chain and a method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3755US2024047384A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3855US2022376034A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3955US2025046702A1Semiconductor structure including crack detector and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4054US11837526B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 5, 2023·0 cites·20 claims
- 4154US2025054934A1Forming a cavity in a redistribution layer of an ic package to reduce overspreading of underfill materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4253US2024363576A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4352US2024243163A1Inductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4449US10937772B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →