Inventor · disambiguated record

Yasuhiro Chida

Also filed as: CHIDA YASUHIRO

1 granted patent·1 pending application·3 citations·filing 2015–2018

20Inventor score

Technology areasH10W

Files withJAPAN AVIATION ELECTRONICS IND LTD1 SHINKAWA KK1

Top patents by PatentIndex Score

2 records

0171US10350692B2Heater for bonding apparatus and method of cooling the sameSHINKAWA KK·Filed 2015·Granted Jul 16, 2019·3 cites·9 claims
0224US2019098786A1Package sealing structure, device package, and package sealing methodJAPAN AVIATION ELECTRONICS IND LTD·Filed 2018·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →