Inventor · disambiguated record
Yao-Chun Chuang
Also filed as: CHUANG YAO-CHUN
69 granted patents·44 pending applications·229 citations·filing 2010–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD83TAIWAN SEMICONDUCTOR MFG12CHUANG YAO-CHUN7REALTEK SEMICONDUCTOR CORP5CHUANG CHITA1
Top patents by PatentIndex Score
113 records- 0196US9425136B2Conical-shaped or tier-shaped pillar connectionsKUO TIN-HAO·Filed 2012·Granted Aug 23, 2016·24 cites·17 claims
- 0295US11728262B2Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·3 cites·20 claims
- 0395US9224688B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·17 cites·20 claims
- 0495US8299616B2T-shaped post for semiconductor devicesCHUANG YAO-CHUN·Filed 2010·Granted Oct 30, 2012·24 cites·20 claims
- 0594US9881885B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·11 cites·19 claims
- 0694US9117825B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 25, 2015·12 cites·19 claims
- 0794US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 0893US8241963B2Recessed pillar structureShen wen-wei·Filed 2010·Granted Aug 14, 2012·18 cites·20 claims
- 0992US10784223B2Elongated bump structures in package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·7 cites·20 claims
- 1092US8232643B2Lead free solder interconnections for integrated circuitsCHUANG YAO-CHUN·Filed 2010·Granted Jul 31, 2012·12 cites·20 claims
- 1190US10056345B2Conical-shaped or tier-shaped pillar connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 21, 2018·5 cites·20 claims
- 1288US9093440B2Connector structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·6 cites·20 claims
- 1386US9397059B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 1486US9257412B2Stress reduction apparatusCHUANG YAO-CHUN·Filed 2012·Granted Feb 9, 2016·6 cites·16 claims
- 1585US9472521B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 18, 2016·7 cites·14 claims
- 1685US2025357382A1Guard Ring StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1784US12068300B2Chip-on-wafer-on-substrate package with improved yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 1883US9741589B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·3 cites·20 claims
- 1983US9673161B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 2082US10515917B2Bump on pad (BOP) bonding structure in semiconductor packaged deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 2182US9991218B2Connector structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
- 2282US2025347602A1Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2381US8227924B2Substrate stand-offs for semiconductor devicesSHEN CHENG HUNG·Filed 2010·Granted Jul 24, 2012·9 cites·20 claims
- 2480US2024105654A1Method of making semiconductor device and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2580US2025357458A1Semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2680US2025364384A1Reduction of cracks in redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2780US2025364391A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2880US2024389239A1Methods and systems for improving surface mount joinderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2979US12334465B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 3079US9905524B2Bump structures in semiconductor device and packaging assemblyCHUANG CHITA·Filed 2011·Granted Feb 27, 2018·4 cites·20 claims
- 3179US9053990B2Bump interconnection techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 9, 2015·5 cites·12 claims
- 3278US12442742B2Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 3378US12107041B2Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 3477US9159695B2Elongated bump structures in package structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·3 cites·18 claims
- 3577US8847387B2Robust joint structure for flip-chip bondingHSIAO CHING-WEN·Filed 2010·Granted Sep 30, 2014·5 cites·15 claims
- 3677US2024379588A1Guard ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3777US2025286007A1Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3877US2024379529A1Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3977US2025351471A1Guard Ring Design For Through ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4077US2025357217A1Edge profile control of integrated circuit chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4176US8659123B2Metal pad structures in diesCHUANG YAO-CHUN·Filed 2011·Granted Feb 25, 2014·4 cites·20 claims
- 4276US2025309120A1Bridge die having different surface orientation than ic dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4376US2024332218A1Devices with through silicon vias, guard rings and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4476US2024332219A1Devices with through silicon vias, guard rings and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4575US12382587B2Methods and systems for improving surface mount joinderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 4675US11088102B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 4775US2025323217A1Integrated fan-out platform and manufacturing method for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4874US2025316546A1Interposer including stepped surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4974US2024332220A1Interposer including a copper edge seal ring structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5074US2025309104A1Delamination control of dielectric layers of integrated circuit chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 113 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →