Inventor · disambiguated record
Yanwei Dai
Also filed as: DAI YANWEI
3 granted patents·1 citations·filing 2018–2023
47Inventor score
Top patents by PatentIndex Score
3 records- 0178US11251106B2Packaging structure of a SiC MOSFET power module and manufacturing method thereofUNIV BEIJING TECHNOLOGY·Filed 2021·Granted Feb 15, 2022·1 cites·4 claims
- 0237US11404329B2Device and method for on-line measurement of wafer grinding forceUNIV BEIJING TECHNOLOGY·Filed 2018·Granted Aug 2, 2022·0 cites·10 claims
- 0331USD1064629SChairGUANGDONG LINSY FURNITURE CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →