Inventor · disambiguated record
Yaomin Deng
Also filed as: DENG YAOMIN
2 granted patents·1 pending application·0 citations·filing 2022–2023
21Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0145US2025018527A1Wafer polishing system and wafer transfer methodHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0244US12017293B2Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrateHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2023·Granted Jun 25, 2024·0 cites·16 claims
- 0337US11794304B2Wafer polishing deviceHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Granted Oct 24, 2023·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →