Inventor · disambiguated record

Yaoyu Ding

Also filed as: DING YAOYU

0 granted patents·1 pending application·0 citations·filing 2024–2024

Technology areasG06F

Files withUNIV ELECTRONIC SCI & TECH CHINA1

Top patents by PatentIndex Score

1 record

0148US2025245408A1Method for 3d reconstruction of solder joint on pcb utilizing neural renderingUNIV ELECTRONIC SCI & TECH CHINA·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →