Inventor · disambiguated record
Yang-Tung Fan
Also filed as: FAN YANG-TUNG
24 granted patents·1,484 citations·filing 1998–2008
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG24
Top patents by PatentIndex Score
24 records- 0196US6482669B1Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 19, 2002·81 cites·13 claims
- 0296US6426281B1Method to form bump in bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·147 cites·17 claims
- 0396US6274917B1High efficiency color filter process for semiconductor array imaging devicesTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Aug 14, 2001·117 cites·9 claims
- 0495US6214717B1Method for adding plasma treatment on bond pad to prevent bond pad staining problemsTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 10, 2001·357 cites·17 claims
- 0593US6605524B1Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 12, 2003·78 cites·24 claims
- 0693US6586323B1Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 1, 2003·76 cites·13 claims
- 0793US6171885B1High efficiency color filter process for semiconductor array imaging devicesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 9, 2001·125 cites·11 claims
- 0891US7183598B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 27, 2007·10 cites·17 claims
- 0991US6632700B1Method to form a color image sensor cell while protecting the bonding pad structure from damageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 14, 2003·58 cites·20 claims
- 1089US6171883B1Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 9, 2001·95 cites·6 claims
- 1185US7816169B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 19, 2010·5 cites·20 claims
- 1285US6956292B2Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·37 cites·20 claims
- 1383US6583039B2Method of forming a bump on a copper padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·37 cites·18 claims
- 1482US6649507B1Dual layer photoresist method for fabricating a mushroom bumping plating structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 18, 2003·33 cites·25 claims
- 1581US6495813B1Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Dec 17, 2002·60 cites·22 claims
- 1678US6936923B2Method to form very a fine pitch solder bump using methods of electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 30, 2005·23 cites·9 claims
- 1776US7485906B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 3, 2009·2 cites·20 claims
- 1875US6486054B1Method to achieve robust solder bump heightTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 26, 2002·25 cites·26 claims
- 1975US6372545B1Method for under bump metal patterning of bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 16, 2002·22 cites·35 claims
- 2073US6876049B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·12 cites·20 claims
- 2170US6765277B2Microelectronic fabrication with corrosion inhibited bond padTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 20, 2004·17 cites·10 claims
- 2269US6168966B1Fabrication of uniform areal sensitivity image arrayTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 2, 2001·35 cites·6 claims
- 2362US6426283B1Method for bumping and backlapping a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 30, 2002·10 cites·18 claims
- 2457US6200712B1Color filter image array optoelectronic microelectronic fabrication with three dimensional color filter layer and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 13, 2001·22 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →